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[null,"1.","Record Nr.",null,"UNINA9910471755603321"]
[null,null,"Titolo",null,"Encyclopedia of packaging materials, processes, and mechanics / editors-in-chief, Avram Bar-Cohen, Jeffrey C. Suhling,, Andrew A. O. Tay"]
[null,null,"Pubbl/distr/stampa",null,"Hackensack, New Jersey : , : World Scientific Publishing Co. Pte. Ltd., , [2020]"]
[null,null,"ISBN",null,"9789811201110"]
[{"$nulls":4},"9789811201127"]
[{"$nulls":4},"9789811201134"]
[{"$nulls":4},"9789811201141"]
[{"$nulls":4},"9789811201158"]
[null,null,"Descrizione fisica",null,"4 volumes : ill. ; 25 cm"]
[null,null,"Disciplina",null,"688.8"]
[null,null,"Locazione",null,"FINBC"]
[null,null,"Collocazione",null,"13 SC V L 19"]
[{"$nulls":4},"13 SC V L 20"]
[{"$nulls":4},"13 SC V L 21"]
[{"$nulls":4},"13 SC V L 22"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"volume 1. Flip-chip and underfill materials and technology / editors, Pengli Zhu, Gang Li, C. P. Wong volume 2. Wire bonding technology / editors, Dae Young Jung, Stephen R. Cain, William (Bill) T. Chen, Bahgat G. Sammakia volume 3. Flexible chip I/O interconnects / editors, Muhannad S. Bakir, Suresh K. Sitaramanof volume 4. Wafer bonding technology / Kuan-Neng Chen, Chuan Seng Tan"]