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[null,"1.","Record Nr.",null,"UNINA9910465182903321"]
[null,null,"Autore",null,"Costello Suzanne"]
[null,null,"Titolo",null,"Hermeticity testing of MEMS and microelectronic packages / / Suzanne Costello, Marc P.Y. Desmulliez"]
[null,null,"Pubbl/distr/stampa",null,"Boston : , : Artech House, , [2013]"]
[{"$nulls":4},"[Piscataqay, New Jersey] : , : IEEE Xplore, , [2013]"]
[null,null,"ISBN",null,"1-5231-1728-1"]
[{"$nulls":4},"1-60807-527-3"]
[null,null,"Descrizione fisica",null,"1 online resource (197 p.)"]
[null,null,"Collana",null,"Integrated microsystems series"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Microelectromechanical systems"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Microelectromechanical systems - Testing"]
[{"$nulls":4},"Microelectronics - Testing"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Preface; References; Part 1 Introduction to Hermetic Package; 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication ; 1.1 Introduction; 1.2 The Evolution of Microelectronics and MEMS Packages; 1.3 MEMS Sealing Techniques and Mode Package Fabrication; 1.3.1 Materials; 1.3.2 Sealing Techniques; 1.4 Summary of MEMS Packaging Materials and Techniques; References; 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS; 2.1 Introduction; 2.2 Particle Contamination ; 2.3 Thermomechanical Constraints; 2.3.1 Thermomechanical Constraints in Di."]
[{"$nulls":4},"2.3.2 Thermomechanical Constraints in Pa2.3.3 Thermomechanical Constraints in Wa; 2.3.4 Thermomechanical Constraints in Fl; 2.4 Moisture and Gas Absorption; 2.4.1 Moisture Absorption; 2.4.2 Barrier Coatings: A Protection Aga; 2.4.3 Outgassing; 2.5 Conclusions: Reliability Demonstration and Accelerated Testing; References; 3 Packaging Requirements for Hermeticity; 3.1 The Need for Hermeticity in MEMS and; 3.2 Balancing Maximum Permissive Leak Ra; References; 4 The Different Types of Leaks in MEMS and Microelectronics Packaging; 4.1 Introduction; 4.2 Leak Channels or Capillary Leaks."]
[{"$nulls":4},"4.3 Permeation4.4 Outgassing; 4.5 Conclusion; References; Part 2 Traditional Hermeticity Test Techniques and Standards; 5 Ex Situ "]
[{"$nulls":4},"Hermeticity Test Methods; 5.1 Introduction; 5.2 Fine Leak Tests; 5.2.1 Helium Fine Leak Test; 5.2.2 Radioisotope Leak Detection Method; 5.3 Gross Leak Tests; 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection; 5.3.2 Gross Bubble Test; 5.3.3 Weight Gain; 5.3.4 Dye Penetrant Gross Leak Test; 5.4 Combinational Tests; 5.4.1 Optical Fine/Gross Leak Detection ; 5.4.2 Cumulative Helium Leak Detection (CHLD) Method; References."]
[{"$nulls":4},"6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 10716.1 Introduction: The First Hermeticity Tests; 6.2 The Introduction of the Military Standards; 6.3 The First Problems with Traditional Hermeticity Tests and Standards; 6.4 Military Standard Revisions; 6.5 Summary; References; Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages; 7 Permeation; 7.1 Introduction; 7.2 Mathematics of Permeation; 7.3 Limitations of the Packaging Material; 7.4 Conclusions; References; 8 Outgassing and Residual Gas Analysis (RGA); 8.1 Outgassing."]
[{"$nulls":4},"8.2 Residual Gas AnalysisReferences; 9 Low-Cavity Volume Capillary Leak Limitatations; 9.1 Limitations of the Helium Fine Leak Test Method; 9.1.1 Volume Limitations; 9.1.2 Minimum Detectable Leak Rate; References; Part 4 Novel Methods of Leak Detection; 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method; 10.1 Introduction; 10.2 Lumped Element Modeling of a Microresonator; 10.3 Definitions and Measurement Methods of the Quality Factor Q; 10.3.1 Definition in Terms of Stored Energy; 10.3.2 Definition in Terms of Bandwidth."]
[null,null,null,"Sommario/riassunto","Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in."]