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[null,"1.","Record Nr.",null,"UNINA9910465175003321"]
[null,null,"Autore",null,"Sturdivant Rick"]
[null,null,"Titolo",null,"Microwave and millimeter-wave electronic packaging / / Rick Sturdivant"]
[null,null,"Pubbl/distr/stampa",null,"Boston [Massachusetts] ; ; London [England] : , : Artech House, , 2014"]
[{"$nulls":4},"[Piscataqay, New Jersey] : , : IEEE Xplore, , [2013]"]
[null,null,"ISBN",null,"1-5231-1742-7"]
[{"$nulls":4},"1-60807-698-9"]
[null,null,"Descrizione fisica",null,"1 online resource (281 p.)"]
[null,null,"Collana",null,"Artech House Microwave Library"]
[null,null,"Disciplina",null,"621.381046"]
[null,null,"Soggetti",null,"Microelectronic packaging"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons."]
[null,null,null,"Sommario/riassunto","Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --"]