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[null,null,"Titolo",null,"ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International"]
[null,null,"Pubbl/distr/stampa",null,"Materials Park, Ohio : , : ASM International, , 2014"]
[{"$nulls":4},"©2014"]
[null,null,"ISBN",null,"1-62708-075-9"]
[{"$nulls":4},"1-68015-514-8"]
[null,null,"Descrizione fisica",null,"1 online resource (560 p.)"]
[null,null,"Disciplina",null,"621.381"]
[null,null,"Soggetti",null,"Electronics - Materials - Testing"]
[{"$nulls":4},"Electronic apparatus and appliances - Testing"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Includes index."]
[null,null,"Nota di contenuto",null,"\"\"Title Page\"\"; \"\"TitlePage_2014\"\"; \"\"COPYRight Page\"\"; \"\"EDFAS 2014 Board of Directors\"\"; \"\"Organizing Committee-2014\"\"; \"\"Technical Program Committee - 2014\"\"; \"\"Contents_2014\"\"; \"\"ISTFA2014_Combined\"\"; \"\"cp2014istfa001\"\"; \"\"cp2014istfa005\"\"; \"\"cp2014istfa006\"\"; \"\"cp2014istfa012\"\"; \"\"cp2014istfa023\"\"; \"\"cp2014istfa028\"\"; \"\"cp2014istfa033\"\"; \"\"cp2014istfa038\"\"; \"\"cp2014istfa043\"\"; \"\"cp2014istfa049\"\"; \"\"cp2014istfa055\"\"; \"\"cp2014istfa065\"\"; \"\"cp2014istfa073\"\"; \"\"cp2014istfa082\"\"; \"\"cp2014istfa087\"\"; \"\"cp2014istfa094\"\"; \"\"cp2014istfa100\"\"; \"\"cp2014istfa105\"\"; \"\"cp2014istfa110\"\""]
[{"$nulls":4},"\"\"cp2014istfa115\"\"\"\"cp2014istfa125\"\"; \"\"cp2014istfa130\"\"; \"\"cp2014istfa136\"\"; \"\"cp2014istfa143\"\"; \"\"cp2014istfa148\"\"; \"\"cp2014istfa152\"\"; \"\"cp2014istfa156\"\"; \"\"cp2014istfa166\"\"; \"\"cp2014istfa172\"\"; \"\"cp2014istfa178\"\"; \"\"cp2014istfa184\"\"; \"\"Combined_189-536\"\"; \"\"Analysis of InGaAs Epi Defects by Conductive AFM\"\"; \"\"Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique\"\"; \"\"Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage â€? Its Model and Cause\"\"; \"\"Feature Based Non-Destructive Fault Isolation in Advanced IC Packages\"\""]
[{"$nulls":4},"\"\"Understanding the Cu Void Formation by TEM Failure Analysis\"\"\"\"microPREPTM - A New Laser Tool for High-Throughput Sample Preparation\"\"; \"\"Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit\"\"; \"\"New Ion Source for High Precision FIB Nanomachining and Circuit Edit\"\"; \"\"Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer\"\"; \"\"Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips\"\""]
[{"$nulls":4},"\"\"Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool\"\"\"\"Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits\"\"; \"\"Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation\"\"; \"\"Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications\"\"; \"\"Marginal Failure Diagnosed with LADA: Case Studies.\"\"; \"\"Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging\"\"; \"\"TDR Analysis On Short Transmission Lines\"\""]
[{"$nulls":4},"\"\"Productive Polishing TEM Sample Preparation Methodology Development\"\"\"\"Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images\"\"; \"\"Delayering on Advanced Process Technologies using FIB\"\"; \"\"Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System\"\"; \"\"Debugging Phase-Locked Loop Failures in Integrated Circuit Products\"\"; \"\"A Novel Method for the Specified Site Planar View TEM Sample Preparation\"\"; \"\"Investigation of Protection Layer Materials for Ex-situ â€?lift-outâ€? TEM Sample Preparation with FIB for 14nm FinFET\"\""]
[{"$nulls":4},"\"\"Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) Imaging\"\""]