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[null,"1.","Record Nr.",null,"UNINA9910458703703321"]
[null,null,"Titolo",null,"Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan"]
[null,null,"Pubbl/distr/stampa",null,"Materials Park, OH, : ASM International, 2005"]
[null,null,"ISBN",null,"1-61503-093-X"]
[null,null,"Descrizione fisica",null,"1 online resource (302 p.)"]
[null,null,"Disciplina",null,"621.381/046"]
[null,null,"Soggetti",null,"Microelectronic packaging - Reliability"]
[{"$nulls":4},"Solder and soldering"]
[{"$nulls":4},"Lead-free electronics manufacturing processes"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"\"\"Contents\"\"; \"\"Foreword\"\"; \"\"Preface\"\"; \"\"Lead-Free Soldering and Environmental Compliance: An Overview\"\"; \"\"Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects\"\"; \"\"Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties\"\"; \"\"Lead-Free Solder Joint Reliability Trends\"\"; \"\"Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects\"\"; \"\"Tin Whisker Growth on Lead-Free Solder Finishes\"\"; \"\"Accelerated Testing Methodology for Lead-Free Solder Interconnects\"\""]
[{"$nulls":4},"\"\"Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects\"\"\"\"Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects\"\"; \"\"Characterization and Failure Analyses of Lead-Free Solder Defects\"\"; \"\"Reliability of Interconnects with Conductive Adhesives\"\"; \"\"Lead-Free Solder Interconnect Reliability Outlook\"\"; \"\"Index\"\""]