{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":20,"n_cols":5,"rows_kept":20,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[2,4,2,5],[3,2,3,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[9,2,9,3],[14,2,14,3],[15,2,15,3],[17,2,17,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910366585403321"]
[null,null,"Autore",null,"Guo Xinfei"]
[null,null,"Titolo",null,"Circadian Rhythms for Future Resilient Electronic Systems : Accelerated Active Self-Healing for Integrated Circuits / / by Xinfei Guo, Mircea R. Stan"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020"]
[null,null,"ISBN",null,"3-030-20051-5"]
[null,null,"Edizione",null,"[1st ed. 2020.]"]
[null,null,"Descrizione fisica",null,"1 online resource (215 pages) : illustrations"]
[null,null,"Disciplina",null,"621.38173"]
[{"$nulls":4},"621.3815"]
[null,null,"Soggetti",null,"Electronic circuits"]
[{"$nulls":4},"Microprocessors"]
[{"$nulls":4},"Circuits and Systems"]
[{"$nulls":4},"Electronic Circuits and Devices"]
[{"$nulls":4},"Processor Architectures"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Introduction to Wearout -- Accelerated Self-Healing Techniques for BTI Wearout -- Accelerating and Activating Recovery for EM Wearout -- Circuit Techniques for Accelerated and Active Recovery -- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience -- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications -- Future Directions in Self-Healing."]
[null,null,null,"Sommario/riassunto","This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor "]
[{"$nulls":4},"and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT."]