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[null,"1.","Record Nr.",null,"UNINA9910299855103321"]
[null,null,"Autore",null,"Qu Shichun"]
[null,null,"Titolo",null,"Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications / / by Shichun Qu, Yong Liu"]
[null,null,"Pubbl/distr/stampa",null,"New York, NY : , : Springer New York : , : Imprint : Springer, , 2015"]
[null,null,"ISBN",null,"1-4939-1556-8"]
[null,null,"Edizione",null,"[1st ed. 2015.]"]
[null,null,"Descrizione fisica",null,"1 online resource (336 p.)"]
[null,null,"Disciplina",null,"620"]
[{"$nulls":4},"621.381"]
[{"$nulls":4},"621.3815"]
[{"$nulls":4},"621.4021"]
[null,null,"Soggetti",null,"Electronics"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Electronic circuits"]
[{"$nulls":4},"Thermodynamics"]
[{"$nulls":4},"Heat engineering"]
[{"$nulls":4},"Heat - Transmission"]
[{"$nulls":4},"Mass transfer"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[{"$nulls":4},"Circuits and Systems"]
[{"$nulls":4},"Engineering Thermodynamics, Heat and Mass Transfer"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references and index."]
[null,null,"Nota di contenuto",null,"Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging -- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package -- Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package -- Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design -- Chapter 5. Wafer Level Discrete Power MOSFET Package Design -- Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution -- Chapter 7. Thermal Management, Design, Analysis for WLCSP -- Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP -- Chapter 9. WLCSP Typical Assembly Process -- Chapter 10. WLCSP Typical Reliability and Test."]
[null,null,null,"Sommario/riassunto","This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP "]
[{"$nulls":4},"packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·         Introduces the development of the analog and power SIP/3D/TSV/stack die packaging technology ·         Presents the wafer-level analog IC packaging design through fan-in and fan-out with RDLs."]
[null,"2.","Record Nr.",null,"UNINA9910640385403321"]
[null,null,"Autore",null,"Theocharis Stamatios"]
[null,null,"Titolo",null,"Semantic Knowledge Modelling via Open Linked Ontologies : Ontologies in E-Governance / / by Stamatios Theocharis, George A. Tsihrintzis"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2023"]
[null,null,"ISBN",null,"9783031205859"]
[{"$nulls":4},"3031205855"]
[null,null,"Edizione",null,"[1st ed. 2023.]"]
[null,null,"Descrizione fisica",null,"1 online resource (381 pages)"]
[null,null,"Collana",null,"Artificial Intelligence-Enhanced Software and Systems Engineering, , 2731-6033 ; ; 4"]
[null,null,"Disciplina",null,"006.31"]
[{"$nulls":4},"352.380285"]
[null,null,"Soggetti",null,"Computational intelligence"]
[{"$nulls":4},"Artificial intelligence"]
[{"$nulls":4},"Software engineering"]
[{"$nulls":4},"Computational Intelligence"]
[{"$nulls":4},"Artificial Intelligence"]
[{"$nulls":4},"Software Engineering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,"Nota di contenuto",null,"Introduction -- e-Government: The concept, the environment & critical issues for the Back-Office systems -- Semantic Web: The evolution of the Web & the opportunities for the e-Government -- Representation and knowledge management for the benefit of e-Government - Opportunities through the tools of the Semantic Web -- Towards Open Data and Open Governance – Representation of knowledge and Triplification of data in the field of the Greek Open Government Data -- Production and publication of linked open data: The case of open ontologies -- Education and E-Government - The case of a Moodle based platform for the education and evaluation of civil servants -- Conclusions – Future Work."]
[null,null,null,"Sommario/riassunto","Evolving technological advances in Artificial Intelligence-empowered Software present significant potential to lead e-Government towards more collective efforts, exchange of experiences on best practices both at national and international levels and dissemination of secluded administrative knowledge. In this book, novel semantic web-based and linked open data-based approaches are developed for the modelling "]
[{"$nulls":4},"and management of the huge volume of administrative data and the procedures followed by public sector bodies and for the production and management of relevant administrative knowledge. The book consists of eight chapters, each of which includes relevant bibliographic references for deeper probing. Appendices complement this work with sections of configuration files of the applications developed and used. Professors, researchers, scientists, engineers and students in artificial intelligence, e-government and other computer science-related disciplines are expected to benefit greatly from it, along with non-specialist readers from other disciplines who are interested in getting versed in the recent developments in e-government."]