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[null,"1.","Record Nr.",null,"UNINA9910299666903321"]
[null,null,"Autore",null,"Raiteri Daniele"]
[null,null,"Titolo",null,"Circuit Design on Plastic Foils / / by Daniele Raiteri, Eugenio Cantatore, Arthur van Roermund"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015"]
[null,null,"ISBN",null,"3-319-11427-1"]
[null,null,"Edizione",null,"[1st ed. 2015.]"]
[null,null,"Descrizione fisica",null,"1 online resource (138 p.)"]
[null,null,"Collana",null,"Analog Circuits and Signal Processing, , 1872-082X"]
[null,null,"Disciplina",null,"620"]
[{"$nulls":4},"621.381"]
[{"$nulls":4},"621.3815"]
[null,null,"Soggetti",null,"Electronic circuits"]
[{"$nulls":4},"Electronics"]
[{"$nulls":4},"Microelectronics"]
[{"$nulls":4},"Circuits and Systems"]
[{"$nulls":4},"Electronic Circuits and Devices"]
[{"$nulls":4},"Electronics and Microelectronics, Instrumentation"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references."]
[null,null,"Nota di contenuto",null,"Introduction -- Applications of large-area electronics on foils -- State of the art in circuit design -- Device modeling and characterization -- Sensor frontend architecture -- Circuit design for analog signal conditioning -- Circuit design for data conversion -- Circuit design for digital processing -- Conclusions."]
[null,null,null,"Sommario/riassunto","This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics.  The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.   • Discusses implications of problems associated with large-area electronics and compares them to standard silicon; • Provides the basis for understanding physics and modeling of disordered material; • Includes guidelines to quickly setup the basic CAD tools enabling efficient and reliable designs; • Illustrates practical solutions to cope with hard/soft faults, variability, mismatch, aging and "]
[{"$nulls":4},"bias stress at architecture, circuit, layout, and device levels."]