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[null,"1.","Record Nr.",null,"UNINA9910299616403321"]
[null,null,"Autore",null,"Liu Xingsheng"]
[null,null,"Titolo",null,"Packaging of High Power Semiconductor Lasers / / by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu"]
[null,null,"Pubbl/distr/stampa",null,"New York, NY : , : Springer New York : , : Imprint : Springer, , 2015"]
[null,null,"ISBN",null,"1-4614-9263-7"]
[null,null,"Edizione",null,"[1st ed. 2015.]"]
[null,null,"Descrizione fisica",null,"1 online resource (415 p.)"]
[null,null,"Collana",null,"Micro- and Opto-Electronic Materials, Structures, and Systems, , 2626-2371"]
[null,null,"Disciplina",null,"621.366"]
[null,null,"Soggetti",null,"Energy systems"]
[{"$nulls":4},"Energy Systems"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging."]
[null,null,null,"Sommario/riassunto","This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed."]