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[null,"1.","Record Nr.",null,"UNINA9910298608203321"]
[null,null,"Titolo",null,"Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications / / edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015"]
[null,null,"ISBN",null,"3-319-18675-2"]
[null,null,"Edizione",null,"[1st ed. 2015.]"]
[null,null,"Descrizione fisica",null,"1 online resource (423 p.)"]
[null,null,"Disciplina",null,"621.38152"]
[null,null,"Soggetti",null,"Electrochemistry"]
[{"$nulls":4},"Electrical engineering"]
[{"$nulls":4},"Semiconductors"]
[{"$nulls":4},"Mechanical engineering"]
[{"$nulls":4},"Biomedical engineering"]
[{"$nulls":4},"Electrical Engineering"]
[{"$nulls":4},"Mechanical Engineering"]
[{"$nulls":4},"Biomedical Engineering and Bioengineering"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET."]
[null,null,null,"Sommario/riassunto","This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects."]