{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":19,"n_cols":5,"rows_kept":19,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[3,2,3,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[12,2,12,3],[13,2,13,3],[16,2,16,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910254168803321"]
[null,null,"Titolo",null,"Carbon Nanotubes for Interconnects : Process, Design and Applications / / edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci"]
[null,null,"Pubbl/distr/stampa",null,"Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017"]
[null,null,"ISBN",null,"3-319-29746-5"]
[null,null,"Edizione",null,"[1st ed. 2017.]"]
[null,null,"Descrizione fisica",null,"1 online resource (XII, 333 p. 167 illus., 133 illus. in color.)"]
[null,null,"Disciplina",null,"621.3815"]
[null,null,"Soggetti",null,"Electronic circuits"]
[{"$nulls":4},"Microprocessors"]
[{"$nulls":4},"Circuits and Systems"]
[{"$nulls":4},"Processor Architectures"]
[{"$nulls":4},"Electronic Circuits and Devices"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters."]
[null,null,"Nota di contenuto",null,"Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs."]
[null,null,null,"Sommario/riassunto","This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics "]
[{"$nulls":4},"industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects."]