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[null,"1.","Record Nr.",null,"UNINA9910171005803321"]
[null,null,"Titolo",null,"Gerontological social work with families : a guide to practice issues and service delivery"]
[null,null,"Pubbl/distr/stampa",null,"[Place of publication not identified], : Haworth Press, 1987"]
[null,null,"ISBN",null,"1-315-79150-1"]
[null,null,"Disciplina",null,"362.6/042"]
[null,null,"Soggetti",null,"Social work with older people - Services for - United States"]
[{"$nulls":4},"Older people - Family relationships - United States"]
[{"$nulls":4},"Older people - Care - United States"]
[{"$nulls":4},"Older people - United States"]
[{"$nulls":4},"Social Welfare & Social Work - General"]
[{"$nulls":4},"Social Welfare & Social Work"]
[{"$nulls":4},"Social Sciences"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,"2.","Record Nr.",null,"UNISALENTO991000358779707536"]
[null,null,"Autore",null,"Labiche, Eugene"]
[null,null,"Titolo",null,"Theatre / Labiche"]
[null,null,"Pubbl/distr/stampa",null,"Paris : Gerard"]
[null,null,"Descrizione fisica",null,"374 p. ; 18 cm."]
[null,null,"Lingua di pubblicazione",null,"Francese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"3.","Record Nr.",null,"UNINA9910787022703321"]
[null,null,"Titolo",null,"11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others]"]
[null,null,"Pubbl/distr/stampa",null,"Pfaffikon, Switzerland : , : TTP, , 2014"]
[{"$nulls":4},"Enfield, New Hampshire : , : Trans Tech Publications Ltd, , [date of distribution not identified]"]
[{"$nulls":4},"©2014"]
[null,null,"ISBN",null,"3-03826-636-1"]
[null,null,"Descrizione fisica",null,"1 online resource (119 p.)"]
[null,null,"Collana",null,"Advanced Materials Research, , 1662-8985 ; ; Volume 1038"]
[null,null,"Disciplina",null,"621.367"]
[null,null,"Soggetti",null,"Molded interconnect devices"]
[{"$nulls":4},"Three-dimensional display systems"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts"]
[{"$nulls":4},"Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz"]
[{"$nulls":4},"Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental "]
[{"$nulls":4},"Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection"]
[{"$nulls":4},"Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index"]
[null,null,null,"Sommario/riassunto","Collection of selected, peer reviewed papers from the 11 th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability."]