{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":1,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":26,"n_cols":5,"rows_kept":26,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[4,2,4,3],[8,2,8,3],[9,2,9,3],[11,2,11,3],[13,2,13,3],[14,2,14,3],[18,2,18,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA9910144100803321"]
[null,null,"Titolo",null,"Advanced plasma technology / / edited by Riccardo d'Agostino [and five others]"]
[null,null,"Pubbl/distr/stampa",null,"Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008"]
[{"$nulls":4},"©2008"]
[null,null,"ISBN",null,"1-281-94675-3"]
[{"$nulls":4},"9786611946753"]
[{"$nulls":4},"3-527-62218-7"]
[{"$nulls":4},"3-527-62219-5"]
[null,null,"Descrizione fisica",null,"1 online resource (481 p.)"]
[null,null,"Disciplina",null,"621.044"]
[{"$nulls":4},"660.004"]
[null,null,"Soggetti",null,"Plasma engineering"]
[{"$nulls":4},"Electronic books."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chaptes and index."]
[null,null,"Nota di contenuto",null,"Advanced Plasma Technology; Contents; Preface; List of Contributors; 1 Basic Approaches to Plasma Production and Control; 1.1 Plasma Production; 1.1.1 Under Low Gas Pressure (10 torr); 1.2 Energy Control; 1.2.1 Electron-Temperature Control; 1.2.2 Ion-Energy Control; 1.3 Dust Collection and Removal; References; 2 Plasma Sources and Reactor Configurations; 2.1 Introduction; 2.2 Characteristics of ICP; 2.2.1 Principle; 2.2.2 Transformer Model; 2.2.3 Technological Aspects; 2.2.3.1 Matching"]
[{"$nulls":4},"2.2.3.2 Capacitive Coupling2.2.3.3 Standing Wave Effects; 2.3 Sources and Reactor Configuration; 2.3.1 Substrate Shape; 2.3.1.1 Flat Substrates; 2.3.1.2 Complex Three-Dimensional Shapes; 2.3.1.3 Large Area Treatment; 2.4 Conclusions; References; 3 Advanced Simulations for Industrial Plasma Applications; 3.1 Introduction; 3.2 PIC Simulations; 3.2.1 Capacitively Coupled O(2)/Ar Plasmas; 3.2.1.1 Gas Composition; 3.2.1.2 Pressure Effect in Ar/O(2) Plasmas; 3.2.2 Three-Dimensional (3D) Charge-up Simulation; 3.2.2.1 Description of 3D Charge-up Simulations"]
[{"$nulls":4},"3.2.2.2 Effects of Secondary Electron Emission3.2.2.3 Negative Ion Extraction; 3.3 Fluid Simulations; 3.3.1 Capacitively Coupled "]
[{"$nulls":4},"Discharges; 3.3.2 Large Area Plasma Source; 3.4 Summary; References; 4 Modeling and Diagnostics of He Discharges for Treatment of Polymers; 4.1 Introduction; 4.2 Experimental; 4.3 Model Description; 4.4 Results and Discussion; 4.4.1 Electrical Properties; 4.4.2 Gas-Phase Chemistry; 4.4.3 Plasma-Surface Interactions; 4.5 Conclusions; References; 5 Three-Dimensional Modeling of Thermal Plasmas (RF and Transferred Arc) for the Design of Sources and Industrial Processes"]
[{"$nulls":4},"5.1 Introduction5.2 Inductively Coupled Plasma Torches; 5.2.1 Modeling Approach; 5.2.1.1 Modeling Assumptions; 5.2.1.2 Governing Equations of the Continuum Phase; 5.2.1.3 Governing Equations of the Discrete Phase; 5.2.1.4 Computational Domain and Boundary Conditions; 5.2.2 Selected Simulation Results; 5.2.2.1 High-Definition Numerical Simulation of Industrial ICPTs; 5.2.2.2 Numerical Simulation of the Trajectories and Thermal Histories of Powders Injected in Industrial ICPTs; 5.3 DC Transferred Arc Plasma Torches; 5.3.1 Modeling Approach; 5.3.1.1 Modeling Assumptions"]
[{"$nulls":4},"5.3.1.2 Governing Equations5.3.1.3 Computational Domain and Boundary Conditions; 5.3.2 Selected Simulation Results; 5.3.2.1 Magnetically Deflected Transferred Arc; 5.3.2.2 The Twin Torch; 5.3.2.3 The Cutting Torch; References; 6 Radiofrequency Plasma Sources for Semiconductor Processing; 6.1 Introduction; 6.2 Capacitively Coupled Plasmas; 6.2.1 Dual-Frequency CCPs; 6.3 Inductively Coupled Plasmas; 6.3.1 General Description; 6.3.2 Anomalous Skin Depth; 6.3.3 Magnetized ICPs; 6.4 Helicon Wave Sources; 6.4.1 General Description; 6.4.2 Unusual Features; 6.4.3 Extended Helicon Sources; References"]
[{"$nulls":4},"7 Advanced Plasma Diagnostics for Thin-Film Deposition"]
[null,null,null,"Sommario/riassunto","A panel of internationally renowned scientists discuss the latest results in plasma technology. This volume has been compiled with both a didactic approach and an overview of the newest achievements for industrial applications. It is divided into two main sections. One is focused on fundamental technology, including plasma production and control, high-pressure discharges, modeling and simulation, diagnostics, dust control, and etching. The section on application technology covers polymer treatments, silicon solar cell, coating and spray, biomaterials, sterilization and waste treatment, plasma"]