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[null,"1.","Record Nr.",null,"UNINA9910130718603321"]
[null,null,"Titolo",null,"2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference"]
[null,null,"Pubbl/distr/stampa",null,"[Place of publication not identified], : IEEE, 2012"]
[null,null,"ISBN",null,"9781467303514"]
[{"$nulls":4},"1467303518"]
[null,null,"Descrizione fisica",null,"1 online resource"]
[null,null,"Disciplina",null,"658.562"]
[null,null,"Soggetti",null,"Process control"]
[{"$nulls":4},"Semiconductor industry - Management"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Bibliographic Level Mode of Issuance: Monograph"]
[null,null,"Nota di contenuto",null,"ASMC 2012 proceedings produced by: semi [advertisement] -- Organizing Committee -- Corporate sponsors -- Table of contents -- Identifying systematic critical features using silicon diagnosis data -- Using selective voltage binning to maximize yield -- Analytic modeling of AC response to FET-level elements for CLY optimization -- Optimizing product yield using manufacturing defect weights -- Improving yield learning by electrical fault inspection -- Innovative approach to identify location of AMC source in cleanroom by inverse Computational Fluid Dynamics modeling -- Managing variability within wafertest production by combining lean and six sigma."]