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[null,"1.","Record Nr.",null,"UNINA9910704201503321"]
[null,null,"Titolo",null,"Taxation : foreign account tax compliance : agreement between the United States of America and Romania, signed at Bucharest, May 28, 2015, with annexes"]
[null,null,"Pubbl/distr/stampa",null,"[Washington, D.C.] : , : United States Department of State, , [2015?]"]
[null,null,"Descrizione fisica",null,"1 online resource (53 unnumbered pages)"]
[null,null,"Collana",null,"Treaties and other international acts series ; ; 15-1103"]
[null,null,"Soggetti",null,"Foreign bank accounts - Law and legislation - Romania"]
[{"$nulls":4},"Foreign bank accounts - Law and legislation - United States"]
[{"$nulls":4},"Tax administration and procedure - International cooperation"]
[{"$nulls":4},"Treaties."]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Title from title screen (viewed on Feb. 19, 2016)."]
[null,"2.","Record Nr.",null,"UNICASNAP0320744"]
[null,null,"Titolo",null,"Il trattamento delle comuni malattie della pelle / traduzione a cura del prof. Luciano Muscardin"]
[null,null,"Pubbl/distr/stampa",null,"Roma, : Il pensiero scientifico, 1974"]
[null,null,"Titolo uniforme",null,"The management of common skin diseases."]
[null,null,"Descrizione fisica",null,"92 p. ; 24 cm."]
[null,null,"Disciplina",null,"616.506"]
[null,null,"Soggetti",null,"Malattie [della] pelle - Terapia"]
[null,null,"Lingua di pubblicazione",null,"Italiano"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"3.","Record Nr.",null,"UNISA996574960003316"]
[null,null,"Titolo",null,"1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits / / Institute of Electrical and Electronics Engineers"]
[null,null,"Pubbl/distr/stampa",null,"New York, New York : , : IEEE, , 2020"]
[null,null,"ISBN",null,"1-5044-6343-9"]
[null,null,"Descrizione fisica",null,"1 online resource (73 pages)"]
[null,null,"Disciplina",null,"621.38132"]
[null,null,"Soggetti",null,"Microwave transmission lines - Standards"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Sommario/riassunto","IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding."]