LEADER 01476nam0 22003613i 450 
001 MIL0202418
005 20251003044228.0
010   $a0471594466
100   $a20090723d1994    ||||0itac50      ba
101 | $aeng
102   $aus
181  1$6z01$ai $bxxxe  
182  1$6z01$an
200 1 $aIntegrated circuit, hybrid, and multichip module package design guidelines$ea focus on reliability$fMichael Pecht
210   $aNew York [etc.]$cWiley$d1994
215   $aXXXI, 426 p. 25 cm.
606   $aCircuiti integrati$xProgettazione$2FIR$3MILC095947$9E
606   $aComponenti elettronici$xMontaggio$2FIR$3CFIC054803$9I
676   $a621.381$9Ingegneria elettronica$v14
676   $a621.381046$9Ingegneria elettronica. Assemblaggio$v22
696   $aChip$aCircuiti elettronici integrati
699   $aCircuiti integrati$yChip
699   $aCircuiti integrati$yCircuiti elettronici integrati
700  1$aPecht$b, Michael$3MILV104044$4070$0719287
790  1$aPecht$b, Michael G.$3MILV157183$zPecht, Michael
801  3$aIT$bIT-000000$c20090723
850   $aIT-BN0095          
901   $bNAP 01$cSALA DING $n$
912   $aMIL0202418
950  0$aBiblioteca Centralizzata di Ateneo$b1 v.$c1 v.$d 01SALA DING 621.381                 PEC.in$e 0102 0000018745  VMA A4                    1 v.$fY $h19940119$i19940119
977   $a 01
996   $aIntegrated circuit, hybrid, and multichip module package design guidelines$91396328
997   $aUNISANNIO