LEADER 03060nam0 22004453i 450 001 BVEE038041 005 20170908093219.0 012 $ab-m. 9.0. 4.3. arar (3) 1607 (R)$2fei$9Pt. 3 012 $ameum s.a, s:o, ReEt (3) 1607 (R)$2fei$9Pt. 1 012 $ao,*- 7.9. uste TuSu (3) 1607 (Q)$2fei$9Pt. 2 Caratteri greci 100 $a20160309d1607 ||||0itac50 ba 101 | $alat 102 $afr 181 1$6z01$ai $bxxxe 182 1$6z01$an 200 1 $a˜M. Valerij Martialis œEpigrammatum libri 15. Laurentij Ramirez de Prado Hispani, nouis commentarijs illustrati. Cum indice omnium verborum Iosephi Langij Caesaremont. & aliis indicibus locupletissisis 210 $aParisijs$capud Michaelem Sonnium, via Iacobaea sub scuto Basiliensi$d1607 215 $a3 pt. (\8!, 388; \12!, 373, \31!; 4, 243, \1! p.)$cill. calcogr.$d4º 300 $aRif.: FRBNF33997945 300 $aTit. della pt. 2: Hypomnemata ad lib. spectaculorum et quatuor primos Epigrammatōn M. Valerij Martialis, collecta ex schedis succisiuis domini Laurentij Ramirez de Prado: 300 $aTit. della pt. 3: Index omnium vocabulorum quae in omnibus M. Val. Martialis poëmatum libris reperiuntur, ... concinnatus ac editus a Iosepho Langio Caesaremontano 300 $aMarca non controllata (Serpe che esce dalle fiamme e morde una mano: Quis contra nos. Iniziali: SM) sui front. delle pt. 1 e 3 300 $aSegn.: ã⁴A-3B⁴3C²;ã⁴ē²A-3D⁴3E²;*²a-z⁴A-G⁴H² 300 $aFront. della pt. 1 stampato in rosso e nero. 316 $a1 v.$5IT-CE0009, SALA A A.61 3.7 423 0$12001 $aHypomnemata ad lib. spectaculorum et quatuor primos Epigrammatōn M. Valerij Martialis, collecta ex schedis succisiuis domini Laurentij Ramirez de Prado: ...$1700 1$aRamírez de Prado$b, Lorenzo$f <1583-1658>$3TO0V162227$4070 423 0$12001 $aIndex omnium vocabulorum quae in omnibus M. Val. Martialis poëmatum libris reperiuntur, ... concinnatus ac editus a Iosepho Langio Caesaremontano.$1700 1$aLang$b, Ioseph$f <1570 ca.-1615>$3BRIV007371$4070 620 $dParigi$3TO0L002626 700 1$aMartialis$b, Marcus Valerius$3CFIV024822$4070$0165201 712 02$aSonnius, Michel$d <2.$f ; 1586-1631>$3BVEV039734$4650 790 0$aMarziale$3CFIV024823$zMartialis, Marcus Valerius 790 1$aMarziale$b, Marco Valerio$3CFIV098467$zMartialis, Marcus Valerius 801 3$aIT$bIT-NA0079$c20160309 850 $aIT-CE0009 912 $aBVEE038041 921 $aSBNM000001$bMarca non controllata$cS2$dSui front. delle pt. 1 e 3. 950 0$aBiblioteca Arcivescovile Cardinale Francesco Serra di Cassano$bPossedute solo 1. e 2. pt. - Carta a4 posta in fine$c1 v.$d CMSALA A A.61 3.7$e CM 0000145855 B 1 v.$fC $h20160309$i20160309 977 $a CM 996 $aEpigrammatum libri 15. Laurentij Ramirez de Prado Hispani, nouis commentarijs illustrati. Cum indice omnium verborum Iosephi Langij Caesaremont. & aliis indicibus locupletissisis$91481300 997 $aUNISANNIO LEADER 04706nam 22006735 450 001 9910163046303321 005 20260814164223.0 010 $a3-319-44586-3 024 7 $a10.1007/978-3-319-44586-1 035 $a(CKB)3710000001041152 035 $a(DE-He213)978-3-319-44586-1 035 $a(MiAaPQ)EBC4791270 035 $a(PPN)198340702 035 $a(EXLCZ)993710000001041152 100 $a20170125d2017 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D Microelectronic Packaging $eFrom Fundamentals to Applications /$fedited by Yan Li, Deepak Goyal 205 $a1st ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) 225 1 $aSpringer Series in Advanced Microelectronics,$x2197-6643 ;$v57 311 08$a3-319-44584-7 320 $aIncludes bibliographical references and index. 327 $aIntroduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . 330 $aThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights intokey areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology. 410 0$aSpringer Series in Advanced Microelectronics,$x2197-6643 ;$v57 606 $aElectronics 606 $aOptical materials 606 $aElectronic circuits 606 $aMicrotechnology 606 $aMicroelectromechanical systems 606 $aMetals 606 $aElectronics and Microelectronics, Instrumentation 606 $aOptical Materials 606 $aElectronic Circuits and Systems 606 $aMicrosystems and MEMS 606 $aMetals and Alloys 615 0$aElectronics. 615 0$aOptical materials. 615 0$aElectronic circuits. 615 0$aMicrotechnology. 615 0$aMicroelectromechanical systems. 615 0$aMetals. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aOptical Materials. 615 24$aElectronic Circuits and Systems. 615 24$aMicrosystems and MEMS. 615 24$aMetals and Alloys. 676 $a621.381 702 $aLi$b Yan$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aGoyal$b Deepak$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910163046303321 996 $a3D Microelectronic Packaging$91934663 997 $aUNINA