LEADER 00727nam a2200217 i 4500 001 991003266489707536 005 20020503185646.0 008 990324s1976 it ||| | ita 035 $ab10481333-39ule_inst 035 $aEXGIL117930$9ExL 040 $aBiblioteca Interfacoltà$bita 100 1 $aSolzenicyn, Aleksandr$0464995 245 10$aLenin a Zurigo 260 $aCles :$bA.Mondadori,$c1976 300 $a316 p. 907 $a.b10481333$b02-04-14$c27-06-02 912 $a991003266489707536 945 $aLE002 Fondo Giudici M 399$g1$iLE002G-399$lle002$o-$pE0.00$q-$rn$so $t0$u0$v0$w0$x0$y.i10555596$z27-06-02 996 $aLenin a Zurigo$9213584 997 $aUNISALENTO 998 $ale002$b01-01-99$cm$da $e-$fita$git $h0$i1 LEADER 00723nam a2200193 i 4500 001 991003636339707536 008 080520s2006 sp 000 0 spa d 020 $a9788496487123 035 $ab13727722-39ule_inst 040 $aDip.to Studi Giuridici$bita 100 1 $aEspinosa Ruiz, Urbano$0628512 245 10$aAdministracion y control territorial en el impero romano :$buna aproximacion historica /$cde Urbano Espinosa 260 $aLa Rioja :$bUniversidad de La Rioja,$c2006 300 $ap. cm 907 $a.b13727722$b20-05-08$c20-05-08 912 $a991003636339707536 996 $aAdministracion y control territorial en el impero romano$91229869 997 $aUNISALENTO 998 $ale027$b20-05-08$cm$da $e-$fspa$gsp $h0$i0 LEADER 03762nam 22005894a 450 001 9911006982203321 005 20250519155614.0 010 $a1-282-02766-2 010 $a9786612027666 010 $a0-08-094698-4 010 $a0-8155-1931-1 035 $a(CKB)1000000000000083 035 $a(EBL)428701 035 $a(OCoLC)468767278 035 $a(SSID)ssj0000073114 035 $a(PQKBManifestationID)11996759 035 $a(PQKBTitleCode)TC0000073114 035 $a(PQKBWorkID)10103276 035 $a(PQKB)10481529 035 $a(MiAaPQ)EBC428701 035 $a(EXLCZ)991000000000000083 100 $a20030811d2004 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aThin film materials technology $esputtering of compound materials /$fby Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi 210 $aNorwich, NY $cWilliam Andrew Pub. ;$aHeidelberg $cSpringer$dc2004 215 $a1 online resource (533 p.) 300 $aDescription based upon print version of record. 311 08$a0-8155-1483-2 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Thin Film Materials Technology: Sputtering of Compound Materials; Copyright Page; Table of Contents; Chapter 1. Thin Film Materials and Devices; 1.1 THIN FILM MATERIALS; 1.2 THIN FILM DEVICES; REFERENCES; Chapter 2. Thin Film Processes; 2.1 THIN FILM GROWTH PROCESS; 2.2 THIN FILM DEPOSITION PROCESS; 2.3 CHARACTERIZATION; REFERENCES; Chapter 3. Sputtering Phenomena; 3.1 SPUTTER YIELD; 3.2 SPUTTERED ATOMS; 3.3 MECHANISMS OF SPUTTERING; REFERENCES; Chapter 4. Sputtering Systems; 4.1 DISCHARGE IN A GAS; 4.2 SPUTTERING SYSTEMS; 4.3 PRACTICAL ASPECTS OF SPUTTERING SYSTEMS; REFERENCES 327 $aChapter 5. Deposition of Compound Thin Films5.1 OXIDES; 5.2 NITRIDES; 5.3 CARBIDES AND SILICIDES; 5.4 DIAMOND; 5.5 SELENIDES; 5.6 AMORPHOUS THIN FILMS; 5.7 SUPERLATTICE STRUCTURES; 5.8 ORGANIC THIN FILMS; 5.9 MAGNETRON SPUTTERING UNDER A STRONG MAGNETIC FIELD; REFERENCES; Chapter 6. Structural Control of Compound Thin Films: Perovskite and Nanometer Oxide Thin Films; 6.1 FERROELECTRIC MATERIALS AND STRUCTURES; 6.2 CONTROL OF STRUCTURE; 6.3 NANOMETER STRUCTURE; 6.4 INTERFACIAL CONTROL; REFERENCES; Chapter 7. Microfabrication by Sputtering; 7.1 CLASSIFICATION OF SPUTTER ETCHING 327 $a7.2 ION-BEAM SPUTTER ETCHING7.3 DIODE SPUTTER ETCHING; 7.4 DEPOSITION INTO DEEP-TRENCH STRUCTURES; REFERENCES; Appendix; Table A.1 Electric Units, Their Symbols and Conversion Factors; Table A.2 Fundamental Physical Constants; List of Acronyms; Index 330 $aAn invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering pro 606 $aCathode sputtering (Plating process) 606 $aThin films 615 0$aCathode sputtering (Plating process) 615 0$aThin films. 676 $a621.3815/2 700 $aWasa$b Kiyotaka$01824221 701 $aKitabatake$b Makoto$01824222 701 $aAdachi$b Hideaki$01824223 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006982203321 996 $aThin film materials technology$94391315 997 $aUNINA