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Torso, pelvis, and lower extremities. 606 $aFlaps (Surgery) 615 0$aFlaps (Surgery) 676 $a617.9/5 701 $aGrabb$b William C$0327507 701 $aStrauch$b Berish$f1933-$01535139 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910780787703321 996 $aGrabb's encyclopedia of flaps$93783115 997 $aUNINA LEADER 05358nam 2200685Ia 450 001 9911019616803321 005 20200520144314.0 010 $a9786610558636 010 $a9781280558634 010 $a1280558636 010 $a9783527606368 010 $a352760636X 010 $a9783527601653 010 $a3527601651 035 $a(CKB)1000000000019379 035 $a(EBL)481512 035 $a(SSID)ssj0000303234 035 $a(PQKBManifestationID)11265541 035 $a(PQKBTitleCode)TC0000303234 035 $a(PQKBWorkID)10275290 035 $a(PQKB)10187079 035 $a(MiAaPQ)EBC481512 035 $a(OCoLC)85820018 035 $a(Perlego)2764183 035 $a(EXLCZ)991000000000019379 100 $a20040218d2004 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aMicrosystem engineering of lab-on-a-chip devices /$f[editors], Oliver Geschke, Henning Klank, Pieter Tellemann 210 $aWeinheim $cWiley-VCH$dc2004 215 $a1 online resource (272 p.) 300 $aDescription based upon print version of record. 311 08$a9783527307333 311 08$a3527307338 320 $aIncludes bibliographical references and index. 327 $aMicrosystem Engineering of Lab-on-a-chip Devices; Contents; Preface; 1 Introduction; 1.1 Learning from the Experiences of Microelectronics; 1.2 The Advantages of Miniaturizing Systems for Chemical Analysis; 1.3 From Concept to ?TAS; 1.4 References; 2 Clean Rooms; 3 Microfluidics - Theoretical Aspects; 3.1 Fluids and Flows; 3.2 Transport Processes; 3.2.1 Types of Transport; 3.2.1.1 Convection; 3.2.1.2 Migration; 3.2.1.3 Diffusion; 3.2.1.4 Dispersion; 3.3 System Design; 3.3.1 Laminar Flow and Diffusion in Action; 3.4 An Application: Biological Fluids; 3.5 References 327 $a4 Microfluidics - Components4.1 Valves and Pumps; 4.1.1 Moving Liquids by Electroosmosis; 4.1.2 Mixers; 4.2 Injecting, Dosing, and Metering; 4.3 Temperature Measurement in Microfluidic Systems; 4.3.1 Microreactors; 4.3.2 Temperature Sensors for Microsystems; 4.3.3 Resistance Temperature Detectors; 4.3.3.1 Metals; 4.3.3.2 Nonmetals; 4.3.4 Thermocouples; 4.3.5 Semiconductor Junction Sensors; 4.3.6 Temperature Sensors Built on Other Principles; 4.3.7 Conclusion; 4.4 Optical Sensors; 4.4.1 Instrumentation; 4.4.2 Absorption Detection; 4.4.3 Evanescent-wave Sensing; 4.4.4 Fluorescence Detection 327 $a4.5 Electrochemical Sensors4.6 References; 5 Simulations in Microfluidics; 5.1 Physical Aspects and Design; 5.2 Choosing Software and Hardware; 5.2.1 CFD-ACE+Version 6.6; 5.2.2 CoventorWareTM Version 2001.3; 5.2.3 Hardware; 5.2.4 The Core Elements of Typical CFD Software; 5.2.5 Pre-processors; 5.2.6 Solvers; 5.2.7 Post-processors; 5.3 Important Numerical Settings; 5.3.1 Boundary Conditions; 5.3.2 Solver Settings; 5.4 Errors and Uncertainties; 5.5 Interpretation and Evaluation of Simulations; 5.6 Example Simulations; 5.6.1 Fully-developed Flow in a Circular Capillary 327 $a5.6.2 Movement of a Chemical Plug by Electroosmotic Flow in a Detection Cell5.6.3 Conclusions; 5.7 References; 6 Silicon and Cleanroom Processing; 6.1 Substrate Fabrication; 6.2 Optical Lithography; 6.2.1 Photolithography; 6.2.2 Mask Design; 6.2.3 Hints in Planning Fabrication Runs; 6.3 Deposition; 6.3.1 Fundamentals of Coatings; 6.3.2 Deposition Methods; 6.3.3 Materials; 6.3.4 Lift-off; 6.3.5 Silicides; 6.4 Etching Removal; 6.4.1 Wet-etching Fundamentals; 6.4.2 Etching with HF; 6.4.3 Isotropic Silicon Etch; 6.4.4 Orientation-dependent Silicon Etching 327 $a6.4.5 Common Orientation-dependent Etchants6.4.6 Other Etchants; 6.4.7 Effects of Not Stirring a Transport-limited Etch; 6.5 Dry Etching; 6.5.1 Plasma Etching Fundamentals; 6.5.2 Plasma Etching Setups; 6.5.3 Etch Gases; 6.5.4 Laser-assisted Etching; 6.6 Heat Treatment; 6.6.1 Thermal Oxidation; 6.6.2 Diffusion; 6.6.3 Annealing; 6.6.4 Wafer Bonding; 6.7 References; 7 Glass Micromachining; 7.1 Wet Chemical Etching; 7.2 Reactive Ion Etching (RIE) of Glass; 7.3 Laser Patterning; 7.4 Powder Blasting; 7.5 Glass Bonding; 7.6 A Microfabrication Example; 7.7 References; 8 Polymer Micromachining 327 $a8.1 Hot Embossing 330 $aWritten on a non-specialist level by an interdisciplinary team of chemists, biologists and engineers from one of Europe's leading centres for microsystem research, the Danish Mikroelektronik Centret (MIC), this is a concise practical introduction to the subject. 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