LEADER 05911nam 2200745Ia 450 001 9910462946803321 005 20200520144314.0 010 $a1-118-43148-0 010 $a1-283-85885-1 010 $a1-118-43140-5 035 $a(CKB)2670000000299602 035 $a(EBL)946970 035 $a(OCoLC)821198911 035 $a(SSID)ssj0000784174 035 $a(PQKBManifestationID)11430892 035 $a(PQKBTitleCode)TC0000784174 035 $a(PQKBWorkID)10760782 035 $a(PQKB)11039332 035 $a(MiAaPQ)EBC946970 035 $a(Au-PeEL)EBL946970 035 $a(CaPaEBR)ebr10631307 035 $a(CaONFJC)MIL417135 035 $a(EXLCZ)992670000000299602 100 $a20120328d2013 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aRF/microwave circuit design for wireless applications$b[electronic resource] /$fUlrich L. Rohde, Matthias Rudolph 205 $a2nd ed. 210 $aHoboken, N.J. $cWiley$d2013 215 $a1 online resource (915 p.) 300 $aDescription based upon print version of record. 311 $a0-470-90181-0 320 $aIncludes bibliographical references and index. 327 $aRF/Microwave Circuit Design for WirelessI Applications; Contents; Foreword; Preface; 1 Introduction to Wireless Circuit Design; 1.1 Introduction; 1.2 System Functions; 1.3 The Radio Channel and Modulation Requirements; 1.3.1 Introduction; 1.3.2 Channel Impulse Response; 1.3.3 Doppler Effect; 1.3.4 Transfer Function; 1.3.5 Time Response of Channel Impulse Response and Transfer Function; 1.3.6 Lessons Learned; 1.3.7 Wireless Signal Example: The TDMA System in GSM; 1.3.7.1 Frequency Division Multiple Access (FDMA); 1.3.7.2 Time-Division Multiple Access (TDMA) 327 $a1.3.7.3 Code-Division Multiple Access (CDMA)1.3.7.4 TDMA in GSM; 1.3.7.5 TDMA Structure; 1.3.7.6 Bit Synchronization; 1.3.7.7 Compensation of Multipath Reception; 1.3.8 From GSM to UMTS to LTE; 1.4 About Bits, Symbols, and Waveforms; 1.4.1 Introduction; 1.4.1.1 Representation of a Modulated RF Carrier; 1.4.1.2 The Spectrum of a Digitally Modulated Carrier; 1.4.2 Some Fundamentals of Digital Modulation Techniques; 1.4.2.1 Spread-Spectrum and CDMA Modulation Techniques; 1.4.2.2 Orthogonal Frequency Division Modulation (OFDM) and Single- Carrier Frequency-Division Multiple Access (SC-FDMA) 327 $a1.5 Analysis of Wireless Systems1.5.1 Analog and Digital Receiver Designs; 1.5.1.1 Receiver Design Examples; 1.5.1.2 PLL CAD Simulation; 1.5.2 Transmitters; 1.5.2.1 Linear Digital Modulation; 1.5.2.2 Digital and Analog FM; 1.5.2.3 Single Sideband AM (SSB-AM); 1.5.2.4 Designing with the SA900; 1.5.2.5 ISM Band Application; 1.6 Building Blocks; 1.7 System Specifications and Their Relationship to Circuit Design; 1.7.1 System Noise and Noise Floor; 1.7.2 System Amplitude and Phase Behavior; 1.8 Testing; 1.8.1 Introduction; 1.8.2 Transmission and Reception Quality; 1.8.3 Base Station Simulation 327 $a1.8.4 GSM1.8.5 DECT; 1.9 Converting C/N or SNR to EB/N0; References; Further Reading; 2 Models for Active Devices; 2.1 Diodes; 2.1.1 Large-Signal Diode Model; 2.1.2 Mixer and Detector Diodes; 2.1.2.1 Junction Capacitance; 2.1.2.2 Parameter Trade-Offs; 2.1.2.3 Mixer Diodes; 2.1.2.4 Linear Diode Model; 2.1.3 PIN Diodes; 2.1.3.1 Introduction; 2.1.3.2 Large-Signal PIN Diode Model; 2.1.3.3 Basic Theory: Variable Resistance; 2.1.3.4 Breakdown Voltage, Capacitance, Q Factor; 2.1.3.5 PIN Diode Applications; 2.1.3.6 Example: A PIN Diode ? Network for TV Tuners; 2.1.4 Tuning Diodes 327 $a2.1.4.1 Introduction2.1.4.2 Tuning Diode Physics; 2.1.4.3 Capacitance; 2.1.4.4 Q Factor or Diode Loss; 2.1.4.5 Distortion Products; 2.1.4.6 Electrical Properties of Tuning Diodes; 2.1.4.7 Diode-Tuned Resonant Circuits; 2.2 Bipolar Transistors; 2.2.1 Transistor Structure Types; 2.2.2 Large-Signal Behavior of Bipolar Transistors; 2.2.2.1 Electrical Characteristics and Specifications; 2.2.3 Large-Signal Transistors in the Forward-Active Region; 2.2.4 Improving RF Performance by Means of Heterostructures 327 $a2.2.5 Effects of Collector Voltage on Large-Signal Characteristics in the Forward-Active Region of BJTs 330 $aProvides researchers and engineers with a complete set of modeling, design, and implementation tools for tackling the newest IC technologies Revised and completely updated, RF/Microwave Circuit Design for Wireless Applications, Second Edition is a unique, state-of-the-art guide to wireless integrated circuit design that provides researchers and engineers with a complete set of modeling, design, and implementation tools for tackling even the newest IC technologies. It emphasizes practical design solutions for high-performance devices and circuitry, incorporating ample exa 606 $aMicrowave circuits$xDesign and construction 606 $aMicrowave integrated circuits$xComputer-aided design 606 $aRadio frequency integrated circuits$xDesign and construction 606 $aSemiconductors$xComputer-aided design 606 $aWireless communication systems$xEquipment and supplies$xDesign and construction 608 $aElectronic books. 615 0$aMicrowave circuits$xDesign and construction. 615 0$aMicrowave integrated circuits$xComputer-aided design. 615 0$aRadio frequency integrated circuits$xDesign and construction. 615 0$aSemiconductors$xComputer-aided design. 615 0$aWireless communication systems$xEquipment and supplies$xDesign and construction. 676 $a621.381/32 676 $a621.38132 700 $aRohde$b Ulrich L$0728646 701 $aRudolph$b Matthias$f1969-$0993370 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910462946803321 996 $aRF$92274490 997 $aUNINA LEADER 00909nam a2200253 i 4500 001 991000333939707536 005 20020527111549.0 008 010810s1977 it ||| | ita 035 $ab10062725-39ule_inst 035 $aPARLA219768$9ExL 040 $aDip.to Filosofia$bita 082 0 $a306.45 100 1 $aSteneck, Nicholas H.$050742 245 10$aScienza e società :$bprocesso alla scienza :$bpassato presente e futuro /$ca cura di Nicholas H. Steneck 260 $aMilano :$bEpisteme,$c1977 300 $a389 p. ;$c23 cm. 490 0 $aCollana Società ;$v1 650 4$aScienze e società 907 $a.b10062725$b17-02-17$c27-06-02 912 $a991000333939707536 945 $aLE005 MF 19 H 28$g1$iLE005A-8665$lle005$o-$pE0.00$q-$rl$s- $t0$u0$v0$w0$x0$y.i10071180$z27-06-02 996 $aScienza e società$9194326 997 $aUNISALENTO 998 $ale005$b01-01-01$cm$da $e-$fita$git $h0$i1