LEADER 01746nam  2200349   450 
001 996575476003316
005 20230415094709.0
010   $a1-7281-4585-6
035   $a(CKB)5280000000211538
035   $a(NjHacI)995280000000211538
035   $a(EXLCZ)995280000000211538
100   $a20230415d2019      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) /$fInstitute of Electrical and Electronics Engineers
210  1$a[Place of publication not identified] :$cInstitute of Electrical and Electronics Engineers,$d2019.
215   $a1 online resource (138 pages)
311   $a1-7281-4586-4 
330   $aEPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.
517   $a2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems 
606   $aElectronic packaging$vCongresses
615  0$aElectronic packaging
676   $a621.381046
801  0$bNjHacI
801  1$bNjHacl
906   $aPROCEEDING
912   $a996575476003316
996   $a2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)$92524530
997   $aUNISA