LEADER 01477nam  2200385   450 
001 996575436403316
005 20230808204309.0
010   $a1-5090-2017-9
035   $a(CKB)4100000008867458
035   $a(WaSeSS)IndRDA00120347
035   $a(EXLCZ)994100000008867458
100   $a20200316d2016      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications $e20-22 July 2016, Chengdu, China /$fsponssored by University of Electronic Science and Technology of China [and four others]
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2016.
215   $a1 online resource (166 pages)
311   $a1-5090-2018-7 
606   $aMicrowave devices$vCongresses
606   $aRadio frequency$vCongresses
606   $aTerahertz technology$vCongresses
615  0$aMicrowave devices
615  0$aRadio frequency
615  0$aTerahertz technology
676   $a621.3813
712 02$aUniversity of Electronic Science and Technology of China,
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a996575436403316
996   $a2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications$92505839
997   $aUNISA