LEADER 02028nam 2200457 450 001 996575376003316 005 20230817193344.0 010 $a1-7281-0409-2 035 $a(CKB)4100000008211743 035 $a(WaSeSS)IndRDA00123044 035 $a(EXLCZ)994100000008211743 100 $a20200514d2019 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a32nd International Conference on VLSI Design $eheld concurrently with 18th International Conference on Embedded Systems : proceedings : New Delhi, India, 5-9 January, 2019 /$fInstitute of Electrical and Electronics Engineers ; in-cooperation with ACM SIGDA/SIGMICRO ; technical co-sponsorship, IEEE Circuits and Systems Society (IEEE CASS) [and six others] ; sponsored by VLSI Society of India 210 1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2019. 215 $a1 online resource (554 pages) 311 $a1-7281-0410-6 606 $aIntegrated circuits$xVery large scale integration$zDesign and construction$vCongresses 606 $aElectronic digital computers$xCircuits$vCongresses 606 $aSignal processing$xDigital techniques$vCongresses 606 $aEmbedded computer systems$vCongresses 615 0$aIntegrated circuits$xVery large scale integration 615 0$aElectronic digital computers$xCircuits 615 0$aSignal processing$xDigital techniques 615 0$aEmbedded computer systems 676 $a65621.395 712 02$aVLSI Society of India, 712 02$aIEEE Circuits and Systems Society, 712 02$aACM Special Interest Group on Microprogramming, 712 02$aACM Special Interest Group on Design Automation, 712 02$aInstitute of Electrical and Electronics Engineers, 801 0$bWaSeSS 801 1$bWaSeSS 906 $aPROCEEDING 912 $a996575376003316 996 $a32nd International Conference on VLSI Design$92546289 997 $aUNISA