LEADER 01707nam  2200361   450 
001 996574831403316
005 20230421082512.0
010   $a1-66540-567-8
035   $a(CKB)4100000012153965
035   $a(NjHacI)994100000012153965
035   $a(EXLCZ)994100000012153965
100   $a20230421d2021      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) $eOctober 5-11,2021, online /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cIEEE,$d[2021]
210  4$dİ2021
215   $a1 online resource (i, 53 pages) $cillustrations
311   $a1-66540-568-6 
330   $aThis workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers presenting new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies.
517   $a2021 7th International Workshop on Low Temperature Bonding for 3D Integration 
606   $aPhotonics$xMaterials$vCongresses
615  0$aPhotonics$xMaterials
676   $a621.36
801  0$bNjHacI
801  1$bNjHacl
906   $aPROCEEDING
912   $a996574831403316
996   $a2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)$92811980
997   $aUNISA