LEADER 01391nam  2200373   450 
001 996574613303316
005 20230824224534.0
010   $a1-7281-4870-7
035   $a(CKB)5280000000207669
035   $a(NjHacI)995280000000207669
035   $a(EXLCZ)995280000000207669
100   $a20230418d2019      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2019 International 3D Systems Integration Conference (3DIC 2019) $eOctober 8-10, 2019, Sendai, Japan /$fInstitute of Electrical and Electronics Engineers
210  1$a[Piscataway, New Jersey] :$cInstitute of Electrical and Electronics Engineers,$d2019.
215   $a1 online resource  (various pagings) $cillustrations
311 0 $a1-7281-4871-5 
606   $aIntegrated circuits$xDesign and construction$vCongresses
606   $aThree-dimensional imaging$vCongresses
606   $aThree-dimensional integrated circuits$vCongresses
615  0$aIntegrated circuits$xDesign and construction
615  0$aThree-dimensional imaging
615  0$aThree-dimensional integrated circuits
676   $a515.43
801  0$bNjHacI
801  1$bNjHacl
906   $aPROCEEDING
912   $a996574613303316
996   $a2019 International 3D Systems Integration Conference (3DIC 2019)$93433028
997   $aUNISA