LEADER 01429nam  2200325   450 
001 996559972603316
005 20231205191950.0
010   $a979-88-557-0216-3
035   $a(CKB)28534578700041
035   $a(NjHacI)9928534578700041
035   $a(EXLCZ)9928534578700041
100   $a20231205d2023      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design /$fIEEE
210  1$aNew York, USA :$cIEEE,$d2023.
215   $a1 online resource (298 pages)
330   $aA method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information-data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information-data.
606   $aPrinted circuits$xDesign and construction
615  0$aPrinted circuits$xDesign and construction.
676   $a621.3
801  0$bNjHacI
801  1$bNjHacl
906   $aBOOK
912   $a996559972603316
996   $a63055-2023 - IEEE$93589745
997   $aUNISA