LEADER 01303nam 2200361 n 450 001 996387587603316 005 20221108022601.0 035 $a(CKB)1000000000632876 035 $a(EEBO)2240869708 035 $a(UnM)99828892 035 $a(UnM)9927967300971 035 $a(EXLCZ)991000000000632876 100 $a19950511d1682 uy | 101 0 $aeng 135 $aurbn||||a|bb| 200 10$aEpistles to the King and Duke$b[electronic resource] 210 $aLondon $cprinted for Tho. Dring, at the Harrow against the Temple-Gate in Fleet-street$dM.DC.LXXXII. [1682] 215 $a[2], 36; 30 p 300 $aBy William Wycherley. 300 $aIn verse. 300 $a"To the King" and "To the Duke. Written in his absence, occasion'd from the sight of some defamatory libels on him" each have caption title, separate register and pagination. 300 $aErrata on p. 36; pp. 29-30 (second sequence) contains a postscript. 300 $aReproduction of the original in the Bodleian Library. 330 $aeebo-0014 700 $aWycherley$b William$f1640-1716.$0163557 801 0$bCu-RivES 801 1$bCu-RivES 801 2$bCStRLIN 801 2$bWaOLN 906 $aBOOK 912 $a996387587603316 996 $aEpistles to the King and Duke$92327623 997 $aUNISA LEADER 01085nam0 22003011i 450 001 UON00513159 005 20231205105508.753 010 $a37-959027-1-1 100 $a20230407d1979 |0itac50 ba 101 $ager 102 $aDE 105 $a|||| ||||| 200 1 $aOpern-Lexikon$fHorst Seeger 205 $a1. Aufl 210 $aWilhelmshaven$cHeinrichshofen's Verlag$d1979 215 $a598 p.$d23 cm 606 $aOPERA IN MUSICA$3UONC044669$2FI 606 $aMUSICA$xEnciclopedie e dizionari$3UONC054510$2FI 620 $dWilhelmshaven$3UONL005466 676 $a780.3$cMusica. 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Goethe 780 R SEE 0978 $eSI 41708 7 0978 996 $aOpern-Lexikon$93902381 997 $aUNIOR LEADER 05946nam 22008533u 450 001 9911019210903321 005 20230120025610.0 010 $a9786612342943 010 $a9781282342941 010 $a1282342940 010 $a9780470727126 010 $a0470727128 010 $a9780470727133 010 $a0470727136 035 $a(CKB)1000000000520026 035 $a(EBL)470287 035 $a(OCoLC)232611467 035 $a(SSID)ssj0000303232 035 $a(PQKBManifestationID)11210476 035 $a(PQKBTitleCode)TC0000303232 035 $a(PQKBWorkID)10275320 035 $a(PQKB)10373254 035 $a(MiAaPQ)EBC470287 035 $a(MiAaPQ)EBC6992864 035 $a(Perlego)2764158 035 $a(EXLCZ)991000000000520026 100 $a20160215d2008|||| u|| | 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aMicrostructural Characterization of Materials 205 $a2nd ed. 210 $aHoboken $cWiley$d2008 215 $a1 online resource (554 p.) 225 0 $aQuantitative software engineering series Microstructural characterization of materials 300 $aDescription based upon print version of record. 311 08$a9780470027844 311 08$a0470027843 327 $aMicrostructural Characterization of Materials; Contents; Preface to the Second Edition; Preface to the First Edition; 1 The Concept of Microstructure; 1.1 Microstructural Features; 1.1.1 Structure-Property Relationships; 1.1.2 Microstructural Scale; 1.1.3 Microstructural Parameters; 1.2 Crystallography and Crystal Structure; 1.2.1 Interatomic Bonding in Solids; 1.2.2 Crystalline and Amorphous Phases; 1.2.3 The Crystal Lattice; Summary; Bibliography; Worked Examples; Problems; 2 Diffraction Analysis of Crystal Structure; 2.1 Scattering of Radiation by Crystals 327 $a2.1.1 The Laue Equations and Bragg's Law2.1.2 Allowed and Forbidden Reflections; 2.2 Reciprocal Space; 2.2.1 The Limiting Sphere Construction; 2.2.2 Vector Representation of Bragg's Law; 2.2.3 The Reciprocal Lattice; 2.3 X-Ray Diffraction Methods; 2.3.1 The X-Ray Diffractometer; 2.3.2 Powder Diffraction-Particles and Polycrystals; 2.3.3 Single Crystal Laue Diffraction; 2.3.4 Rotating Single Crystal Methods; 2.4 Diffraction Analysis; 2.4.1 Atomic Scattering Factors; 2.4.2 Scattering by the Unit Cell; 2.4.3 The Structure Factor in the Complex Plane 327 $a2.4.4 Interpretation of Diffracted Intensities2.4.5 Errors and Assumptions; 2.5 Electron Diffraction; 2.5.1 Wave Properties of Electrons; 2.5.2 Ring Patterns, Spot Patterns and Laue Zones; 2.5.3 Kikuchi Patterns and Their Interpretation; Summary; Bibliography; Worked Examples; Problems; 3 Optical Microscopy; 3.1 Geometrical Optics; 3.1.1 Optical Image Formation; 3.1.2 Resolution in the Optical Microscope; 3.1.3 Depth of Field and Depth of Focus; 3.2 Construction of the Microscope; 3.2.1 Light Sources and Condenser Systems; 3.2.2 The Specimen Stage; 3.2.3 Selection of Objective Lenses 327 $a3.2.4 Image Observation and Recording3.3 Specimen Preparation; 3.3.1 Sampling and Sectioning; 3.3.2 Mounting and Grinding; 3.3.3 Polishing and Etching Methods; 3.4 Image Contrast; 3.4.1 Reflection and Absorption of Light; 3.4.2 Bright-Field and Dark-Field Image Contrast; 3.4.3 Confocal Microscopy; 3.4.4 Interference Contrast and Interference Microscopy; 3.4.5 Optical Anisotropy and Polarized Light; 3.4.6 Phase Contrast Microscopy; 3.5 Working with Digital Images; 3.5.1 Data Collection and The Optical System; 3.5.2 Data Processing and Analysis; 3.5.3 Data Storage and Presentation 327 $a3.5.4 Dynamic Range and Digital Storage3.6 Resolution, Contrast and Image Interpretation; Summary; Bibliography; Worked Examples; Problems; 4 Transmission Electron Microscopy; 4.1 Basic Principles; 4.1.1 Wave Properties of Electrons; 4.1.2 Resolution Limitations and Lens Aberrations; 4.1.3 Comparative Performance of Transmission and Scanning Electron Microscopy; 4.2 Specimen Preparation; 4.2.1 Mechanical Thinning; 4.2.2 Electrochemical Thinning; 4.2.3 Ion Milling; 4.2.4 Sputter Coating and Carbon Coating; 4.2.5 Replica Methods; 4.3 The Origin of Contrast; 4.3.1 Mass-Thickness Contrast 327 $a4.3.2 Diffraction Contrast and Crystal Lattice Defects 330 $aMicrostructural characterization is usually achieved by allowing some form of probe to interact with a carefully prepared specimen. The most commonly used probes are visible light, X-ray radiation, a high-energy electron beam, or a sharp, flexible needle. These four types of probe form the basis for optical microscopy, X-ray diffraction, electron microscopy, and scanning probe microscopy.

Microstructural Characterization of Materials, 2nd Edition is an introduction to the expertise involved in assessing the microstructure of engineering materials and to the experimental met 606 $aElectronic books. -- local 606 $aMaterials -- Microscopy 606 $aMicrostructure 606 $aMaterials$xMicroscopy 606 $aMicrostructure 606 $aMaterials Science$2HILCC 606 $aChemical & Materials Engineering$2HILCC 606 $aEngineering & Applied Sciences$2HILCC 615 4$aElectronic books. -- local. 615 4$aMaterials -- Microscopy. 615 4$aMicrostructure. 615 0$aMaterials$xMicroscopy. 615 0$aMicrostructure. 615 7$aMaterials Science 615 7$aChemical & Materials Engineering 615 7$aEngineering & Applied Sciences 676 $a620.1/1299 700 $aBrandon$b David$0747018 701 $aKaplan$b Wayne D$0747019 701 $aBrandon$b D. G$01838783 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 906 $aBOOK 912 $a9911019210903321 996 $aMicrostructural Characterization of Materials$94417852 997 $aUNINA LEADER 05380nam 22007094a 450 001 9911019744903321 005 20200520144314.0 010 $a9786610368099 010 $a9781280368097 010 $a1280368098 010 $a9780470342657 010 $a047034265X 010 $a9780471648284 010 $a0471648280 010 $a9780471648291 010 $a0471648299 035 $a(CKB)111090529063298 035 $a(EBL)875728 035 $a(SSID)ssj0000233523 035 $a(PQKBManifestationID)11201130 035 $a(PQKBTitleCode)TC0000233523 035 $a(PQKBWorkID)10240206 035 $a(PQKB)10178405 035 $a(MiAaPQ)EBC875728 035 $a(OCoLC)85820095 035 $a(PPN)257490817 035 $a(Perlego)2767193 035 $a(EXLCZ)99111090529063298 100 $a20030930d2004 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aReal-time systems design and analysis /$fPhillip A. Laplante 205 $a3rd ed. 210 $aHoboken, N.J. $cWiley$d2004 215 $a1 online resource (529 p.) 300 $aDescription based upon print version of record. 311 08$a9780471228554 311 08$a0471228559 320 $aIncludes bibliographical references (p. 475-485) and index. 327 $aREAL-TIME SYSTEMS DESIGN AND ANALYSIS; CONTENTS; Preface to the Third Edition; 1 Basic Real-Time Concepts; 1.1 Terminology; 1.1.1 Systems Concepts; 1.1.2 Real-Time Definitions; 1.1.3 Events and Determinism; 1.1.4 CPU Utilization; 1.2 Real-Time System Design Issues; 1.3 Example Real-Time Systems; 1.4 Common Misconceptions; 1.5 Brief History; 1.5.1 Theoretical Advances; 1.5.2 Early Systems; 1.5.3 Hardware Developments; 1.5.4 Early Software; 1.5.5 Commercial Operating System Support; 1.6 Exercises; 2 Hardware Considerations; 2.1 Basic Architecture; 2.2 Hardware Interfacing; 2.2.1 Latching 327 $a2.2.2 Edge versus Level Triggered2.2.3 Tristate Logic; 2.2.4 Wait States; 2.2.5 Systems Interfaces and Buses; 2.3 Central Processing Unit; 2.3.1 Fetch and Execute Cycle; 2.3.2 Microcontrollers; 2.3.3 Instruction Forms; 2.3.4 Core Instructions; 2.3.5 Addressing Modes; 2.3.6 RISC versus CISC; 2.4 Memory; 2.4.1 Memory Access; 2.4.2 Memory Technologies; 2.4.3 Memory Hierarchy; 2.4.4 Memory Organization; 2.5 Input/Output; 2.5.1 Programmed Input/Output; 2.5.2 Direct Memory Access; 2.5.3 Memory-Mapped Input/Output; 2.5.4 Interrupts; 2.6 Enhancing Performance; 2.6.1 Locality of Reference; 2.6.2 Cache 327 $a2.6.3 Pipelining2.6.4 Coprocessors; 2.7 Other Special Devices; 2.7.1 Applications-Specific Integrated Circuits; 2.7.2 Programmable Array Logic/Programmable Logic Array; 2.7.3 Field-Programmable Gate Arrays; 2.7.4 Transducers; 2.7.5 Analog/Digital Converters; 2.7.6 Digital/Analog Converters; 2.8 Non-von-Neumann Architectures; 2.8.1 Parallel Systems; 2.8.2 Flynn's Taxonomy for Parallelism; 2.9 Exercises; 3 Real-Time Operating Systems; 3.1 Real-Time Kernels; 3.1.1 Pseudokernels; 3.1.2 Interrupt-Driven Systems; 3.1.3 Preemptive-Priority Systems; 3.1.4 Hybrid Systems 327 $a3.1.5 The Task-Control Block Model3.2 Theoretical Foundations of Real-Time Operating Systems; 3.2.1 Process Scheduling; 3.2.2 Round-Robin Scheduling; 3.2.3 Cyclic Executives; 3.2.4 Fixed-Priority Scheduling-Rate-Monotonic Approach; 3.2.5 Dynamic-Priority Scheduling: Earliest-Deadline-First Approach; 3.3 Intertask Communication and Synchronization; 3.3.1 Buffering Data; 3.3.2 Time-Relative Buffering; 3.3.3 Ring Buffers; 3.3.4 Mailboxes; 3.3.5 Queues; 3.3.6 Critical Regions; 3.3.7 Semaphores; 3.3.8 Other Synchronization Mechanisms; 3.3.9 Deadlock; 3.3.10 Priority Inversion 327 $a3.4 Memory Management3.4.1 Process Stack Management; 3.4.2 Run-Time Ring Buffer; 3.4.3 Maximum Stack Size; 3.4.4 Multiple-Stack Arrangements; 3.4.5 Memory Management in the Task-Control-Block Model; 3.4.6 Swapping; 3.4.7 Overlays; 3.4.8 Block or Page Management; 3.4.9 Replacement Algorithms; 3.4.10 Memory Locking; 3.4.11 Working Sets; 3.4.12 Real-Time Garbage Collection; 3.4.13 Contiguous File Systems; 3.4.14 Building versus Buying Real-Time Operating Systems; 3.4.15 Selecting Real-Time Kernels; 3.5 Case Study: POSIX; 3.5.1 Threads; 3.5.2 POSIX Mutexes and Condition Variables 327 $a3.5.3 POSIX Semaphores 330 $aThe leading guide to real-time systems design-revised and updatedThis third edition of Phillip Laplante's bestselling, practical guide to building real-time systems maintains its predecessors' unique holistic, systems-based approach devised to help engineers write problem-solving software. Dr. Laplante incorporates a survey of related technologies and their histories, complete with time-saving practical tips, hands-on instructions, C code, and insights into decreasing ramp-up times.Real-Time Systems Design and Analysis, Third Edition is essential for students and practicing sof 606 $aReal-time data processing 606 $aSystem design 615 0$aReal-time data processing. 615 0$aSystem design. 676 $a004/.33 700 $aLaplante$b Phillip A$0149868 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019744903321 996 $aReal-time systems, design and analysis$9331127 997 $aUNINA