LEADER 01698nam 2200313Ia 450 001 996384531503316 005 20200824132508.0 035 $a(CKB)4940000000073001 035 $a(EEBO)2240942606 035 $a(OCoLC)ocm11232357e 035 $a(OCoLC)11232357 035 $a(EXLCZ)994940000000073001 100 $a19841005d1642 uy | 101 0 $aeng 135 $aurbn||||a|bb| 200 14$aThe declaration of the Lords and Commons assembled in Parliament concerning His Majesties letter and the petition of diverse noblemen, gentlemen, burgesses, and ministers, to the Privy Councell of Scotland$b[electronic resource] $elikewise severall passages concerning the Lord Keeper of the Great Seale of England : as also an order for the searching and staying of all armes ... that shall be carried towards the north part of England 210 $aLondon $cPrinted for Joseph Hunscott and John Wright$d1642 215 $a[2], 6 p 300 $a"Mercurii 15, 1642. Ordered by the Lords and Commons assembled in Parliament, that this declaration, with the particulars, be forthwith printed and published. Iohn Brown, Cler. Parliamentor." 300 $aReproduction of the original in the Bodleian Library. 330 $aeebo-0014 607 $aGreat Britain$xHistory$yCivil War, 1642-1649 607 $aGreat Britain$xPolitics and government$y1642-1649 801 1$bEAE 801 2$bWaOLN 906 $aBOOK 912 $a996384531503316 996 $aThe declaration of the Lords and Commons assembled in Parliament concerning His Majesties letter and the petition of diverse noblemen, gentlemen, burgesses, and ministers, to the Privy Councell of Scotland$92312011 997 $aUNISA LEADER 05970nam 22007453u 450 001 9910137852403321 005 20230725045353.0 010 $a1-299-31442-2 010 $a0-470-82782-3 010 $a0-470-82781-5 035 $a(CKB)3280000000000225 035 $a(EBL)818629 035 $a(OCoLC)756280855 035 $a(SSID)ssj0000565672 035 $a(PQKBManifestationID)11367216 035 $a(PQKBTitleCode)TC0000565672 035 $a(PQKBWorkID)10532903 035 $a(PQKB)10684069 035 $a(MiAaPQ)EBC818629 035 $a(EXLCZ)993280000000000225 100 $a20130418d2011|||| u|| | 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aModeling and Simulation for Microelectronic Packaging Assembly$b[electronic resource] $eManufacturing, Reliability and Testing 210 $aChicester $cWiley$d2011 215 $a1 online resource (588 p.) 300 $aDescription based upon print version of record. 311 $a0-470-82780-7 327 $aModeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis 327 $a1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References 327 $a3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework 327 $a3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology 327 $a4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill 327 $a4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling 330 $aAlthough there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people 606 $aMicroelectronic packaging - Simulation methods 606 $aMicroelectronic packaging -- Simulation methods 606 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General 606 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General 606 $aMicroelectronic packaging$xSimulation methods 606 $aElectrical & Computer Engineering$2HILCC 606 $aEngineering & Applied Sciences$2HILCC 606 $aElectrical Engineering$2HILCC 615 4$aMicroelectronic packaging - Simulation methods. 615 4$aMicroelectronic packaging -- Simulation methods. 615 4$aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General. 615 4$aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General. 615 0$aMicroelectronic packaging$xSimulation methods 615 7$aElectrical & Computer Engineering 615 7$aEngineering & Applied Sciences 615 7$aElectrical Engineering 676 $a621.381046 686 $aTEC008010$2bisacsh 700 $aLiu$b Sheng$0898248 701 $aLiu$b Yong$0720834 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 906 $aBOOK 912 $a9910137852403321 996 $aModeling and Simulation for Microelectronic Packaging Assembly$92007071 997 $aUNINA