LEADER 00555nam 2200193z- 450 001 996320830503316 005 20160818152920.0 035 $a(CKB)9870000000000615 035 $a(EXLCZ)999870000000000615 100 $a20131117c2013uuuu -u- - 101 0 $aeng 200 10$aEstimating consumer damages in cartel cases 210 $aMannheim$cZEW 701 $aLaitenberger$bUlrich$01010914 701 $aSmuda$bFlorian$01010915 906 $aBOOK 912 $a996320830503316 996 $aEstimating consumer damages in cartel cases$92340020 997 $aUNISA LEADER 04904nam 2200613 450 001 9910460219703321 005 20200520144314.0 010 $a1-62708-075-9 010 $a1-68015-514-8 035 $a(CKB)3710000000323691 035 $a(EBL)3002486 035 $a(SSID)ssj0001470653 035 $a(PQKBManifestationID)11826916 035 $a(PQKBTitleCode)TC0001470653 035 $a(PQKBWorkID)11412128 035 $a(PQKB)11271454 035 $a(MiAaPQ)EBC3002486 035 $a(Au-PeEL)EBL3002486 035 $a(CaPaEBR)ebr10998999 035 $a(OCoLC)929147993 035 $a(EXLCZ)993710000000323691 100 $a20150109h20142014 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aISTFA 2014 $econference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA /$forganized by Electronic Device Failure Analysis Society, ASM International 210 1$aMaterials Park, Ohio :$cASM International,$d2014. 210 4$dİ2014 215 $a1 online resource (560 p.) 300 $aIncludes index. 311 $a1-62708-074-0 327 $a""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee - 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110"" 327 $a""cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage a??? Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages"" 327 $a""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM - A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips"" 327 $a""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines"" 327 $a""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ a???lift-outa??? TEM Sample Preparation with FIB for 14nm FinFET"" 327 $a""Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) Imaging"" 606 $aElectronics$xMaterials$xTesting$vCongresses 606 $aElectronic apparatus and appliances$xTesting$vCongresses 608 $aElectronic books. 615 0$aElectronics$xMaterials$xTesting 615 0$aElectronic apparatus and appliances$xTesting 676 $a621.381 712 02$aElectronic Device Failure Analysis Society, 712 02$aASM International, 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910460219703321 996 $aISTFA 2014$92192495 997 $aUNINA