LEADER 00906nam0-22003251--450- 001 990004532900403321 005 20120528122542.0 035 $a000453290 035 $aFED01000453290 035 $a(Aleph)000453290FED01 035 $a000453290 100 $a19990604d1933----km-y0itay50------ba 101 0 $aita 102 $aIT 105 $ay-------001yy 200 1 $aVescovi e città$esec. 4.-6.$fSergio Mochi Onory 210 $aBologna$cZanichelli$d1933 215 $aXXX, 348 p.$d23 cm 225 1 $aBiblioteca della Rivista di storia del diritto italiano$v8 676 $a282.456 700 1$aMochi Onory,$bSergio$0180187 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990004532900403321 952 $aV H 164 (8)$b57667$fFGBC 952 $a282.45 MOC 1$bBibl. 11930$fFLFBC 959 $aFLFBC 959 $aFGBC 996 $aVescovi e città$9252322 997 $aUNINA LEADER 05395oam 2200721 c 450 001 996308788503316 005 20220221094418.0 010 $a3-8394-1378-8 024 7 $a10.14361/transcript.9783839413784 035 $a(CKB)2550000001338497 035 $a(EBL)1914649 035 $a(SSID)ssj0001336429 035 $a(PQKBManifestationID)11870264 035 $a(PQKBTitleCode)TC0001336429 035 $a(PQKBWorkID)11295810 035 $a(PQKB)11656144 035 $a(MiAaPQ)EBC1914649 035 $a(DE-B1597)396031 035 $a(OCoLC)905918945 035 $a(OCoLC)979884442 035 $a(DE-B1597)9783839413784 035 $a(MiAaPQ)EBC6695185 035 $a(Au-PeEL)EBL6695185 035 $a(OCoLC)1110446333 035 $a(ScCtBLL)fe2500aa-ee42-4df2-b394-b591d8c4fd1a 035 $a(transcript Verlag)9783839413784 035 $a(EXLCZ)992550000001338497 100 $a20220221d2014 uy 0 101 0 $ager 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 14$aDie politische Ordnung des Flu?chtlingslagers$eAkteure - Macht - Organisation. Eine Ethnographie im Su?dlichen Afrika$fKatharina Inhetveen 205 $a1st ed. 210 $aBielefeld$ctranscript Verlag$d2014 215 $a1 online resource (445 p.) 225 0 $aGlobal Studies 300 $aDescription based upon print version of record. 311 $a3-8376-1378-X 311 $a1-322-00532-X 320 $aIncludes bibliographical references. 327 $a1 Inhalt 5 Kapitel 1. Die Ordnung des Flu?chtlingslagers 13 Kapitel 2. Zum theoretischen Instrumentarium 25 Kapitel 3. Zum methodischen Vorgehen 39 Kapitel 4. Meheba und Nangweshi 61 Kapitel 5. U?berblick u?ber die Arbeit 71 Kapitel 6. Formale Strukturen sambischer Flu?chtlingslager 81 Kapitel 7. Nationale Souvera?nita?t im internationalisierten Regime 93 Kapitel 8. NGOs und UNHCR im Flu?chtlingslager 119 Kapitel 9. ,Flu?chtling' sein 141 Kapitel 10. Flu?chtlingsvertreter als Intermedia?re 165 Kapitel 11. Polyhierarchische Strukturen 193 Kapitel 12. Flu?chtlingslager zwischen Freiwilligkeit und Zwang 213 Kapitel 13. Die dauerhafte Vorla?ufigkeit von Flu?chtlingslagern 253 Kapitel 14. Importierte Machtstrukturen in Flu?chtlingslagern 271 Kapitel 15. Frei flottierendes Misstrauen 313 Kapitel 16. Die Vera?nderung von Kollektiven als institutionelles Ziel von Flu?chtlingslagern 329 Kapitel 17. Leben statt Unterleben 359 Kapitel 18. Schluss 391 Literatur 407 Abku?rzungen 435 Abbildungen 437 Dank 439 441 330 $aWeltweit werden Flu?chtlinge langfristig in Flu?chtlingslagern untergebracht. Heterogene Akteure - UNO, NGOs, Regierungsvertreter, aber auch die Flu?chtlinge selbst - bringen ihre Perspektiven, Interessen, Ressourcen und Außenbeziehungen in die Flu?chtlingslager ein. Deren politische Ordnung konstituiert sich zwischen interner Machtdynamik und institutioneller Einbettung in das internationale Flu?chtlingsregime. Ausgehend von Neo-Institutionalismus und Theorien der Kasernierung rekonstruiert Katharina Inhetveen diese Ordnung am Fall zweier Lager in Sambia. Ein innovativer, empirisch fundierter Beitrag zur politischen Soziologie des Flu?chtlingslagers. 330 1 $a»Die besondere Qualita?t der Arbeit liegt [...] in der sehr genauen Ethnographie der Akteure und ihrer Beziehungen, in der die wechselseitigen Zuschreibungen und Deutungen, vielfa?ltigen Widerspru?che, Spannungen und Ambivalenzen abgebildet werden, die den Alltag in den Lagern pra?gen.« Dieter Neubert, Soziologische Revue, 35 (2012) »Der Autorin ist eine klar strukturierte und dabei sehr facettenreiche Charakteristik der Institution Flu?chtlingslager gelungen [..].« Portal fu?r Politikwissenschaft, 19.01.2011 »Insgesamt wird [...] ein sehr differenziertes Bild von Flu?chtlingslagern unter ethnographischen und soziologischen Aspekten entworfen. [Die Lektu?re] ist im Bereich der humanita?ren Hilfe und speziell in diesem Arbeitsfeld ta?tigen Fachleuten durchaus zu empfehlen.« Michael Marx, welt.sichten, 3 (2011) Besprochen in: www.iz3w.org, 8 (2011), Kerstin Bischl 410 0$aGlobal studies (Bielefeld, Germany) 606 $aFlu?chtlingslager; Politik; Migration; Organisation; Afrika; Sambia; Migrationspolitik; Politische Soziologie; Internationale Politik; Politikwissenschaft; Soziologie; Politics; Africa; Migration Policy; Political Sociology; International Relations; Political Science; Sociology; 610 $aAfrica. 610 $aInternational Relations. 610 $aMigration Policy. 610 $aMigration. 610 $aPolitical Science. 610 $aPolitical Sociology. 610 $aSociology. 615 4$aFlu?chtlingslager; Politik; Migration; Organisation; Afrika; Sambia; Migrationspolitik; Politische Soziologie; Internationale Politik; Politikwissenschaft; Soziologie; Politics; Africa; Migration Policy; Political Sociology; International Relations; Political Science; Sociology; 676 $a362.8783 700 $aInhetveen$b Katharina$4aut$0997779 801 0$bDE-B1597 801 1$bDE-B1597 906 $aBOOK 912 $a996308788503316 996 $aDie politische Ordnung des Flüchtlingslagers$92288382 997 $aUNISA LEADER 09831oam 2200433zu 450 001 996213505003316 005 20210807003533.0 035 $a(CKB)111055184250310 035 $a(SSID)ssj0000454460 035 $a(PQKBManifestationID)12173450 035 $a(PQKBTitleCode)TC0000454460 035 $a(PQKBWorkID)10397597 035 $a(PQKB)11350107 035 $a(NjHacI)99111055184250310 035 $a(EXLCZ)99111055184250310 100 $a20160829d2001 uy 101 0 $aeng 135 $aur||||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$a2001 IEEE Electrical Performance of Electronic Packaging 210 31$a[Place of publication not identified]$cI E E E$d2001 215 $a1 online resource (xi, 344 pages) $cillustrations 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-7803-7024-4 320 $aIncludes bibliographical references and index. 327 $aMONDAY, OCTOBER 29, 2001 -- SESSION I - KEYNOTE -- A Future View of Server Systems (Keynote) 3 (4) -- SESSION II - LOW POWER -- Architectural Approaches to Reducing Power Rtem Costs (Invited Paper) 7 (2) -- ``Watts'' the Matter: Power Reduction Issues (Invited Paper) 9 (2) -- Digital Signal Processors (DSPs) for Low Power Consumption Wireless Applications (Invited Paper) 11 (6) -- SESSION III - RF/MICROWAVE -- Characterization of the Novel Anisotropic Uniplanar Compact Photonic Band-Gap Ground Plane (UC-PBG-GP) 17 (4) -- Measuring Radiation of Small Electronic Equipment in Three-Dimensional TEM Cells 21 (4) -- Effects of Decreasing Extent of Electromagnetic Field at LSI Mounting Area on Radiated Emission from PCB 25 (4) -- Millimeter Wave Package Design: A Comparison of Simulation and Measurement Results 29 (6) -- SESSION IV - TRANSMISSION LINE MODELING -- Recovering Lossy Multiconductor Transmission Line Parameters From Impedance or Scattering Representations 35 (4) -- The Effects of Via Transitions on Differential Signals 39 (4) -- Analysis of Transmission Line Circuits Using Multi-Dimensional Model Reduction Techniques (Student Paper) 43 (4) -- Prime: Passive Realization of Interconnect Models from Measured Data 47 (4) -- Time-Domain Scattering Method Using Triangle Impulse Responses for Modeling Electronic Packaging Components 51 (4) -- Analysis of Transmission Line Structures Using a Dynamic Analysis through WIPL-D 55 (6) -- SESSION V - OPEN FORUM (POSTERS) AND RECEPTION -- Power Distribution -- Reducing Power Bus Impedance at Resonance with Lossy Components (Student Paper) 61 (4) -- Characterization of Via-Induced Parallel-Plate Resonances in a Printed Circuit Board 65 (4) -- Modelling of Multi-Layered Power Supply Planes with Vias 69 (4) -- Characterization of On-Chip Capacitance Effects for I/O Circuits and Core Circuits 73 (4) -- Analysis of Power/Ground Planes by PCB Simulator with Model Order Reduction Technique 77 (4) -- Signal Integrity -- The Use of Loop Inductances in Signal Integrity Modeling 81 (4) -- Design and Verification of Differential Transmission Lines 85 (4) -- Composite Effects of Reflections and Ground Bounce for Signal Line through a Split Power Plane 89 (4) -- Microwave -- Integrated RF Function Architectures in Fully-Organic SOP Technology 93 (4) -- Development of RF/Microwave On-chip Inductors Using an Organic Micromachining Process 97 (4) -- Development of Planar Antennas in Multi-layer Packages for RF-System-on-a-Package Applications 101 (4) -- CPW High Q Inductors on Organic Substrates (Student Paper) 105 (4) -- Microwave Frequency Crosstalk Model of Redistribution Line Patterns of Wafer Level Package 109 (4) -- Measurements -- Robust Extraction of the Frequency-Dependent Characteristic Impedance of Transmission Lines using One-port TDR Measurements - (Student Paper) 113 (4) -- Picosecond-pulse Propagation Measurement on Microstrip Meander Lines Using a Novel Optical Near-Field Mapping Probe (Student Paper) 117 (4) -- Measurement of RF Properties of Glob Top and Under-Encapsulant Materials 121 (4) -- A Broad Band Through-Line-Line De-Embedding Technique for BGA Package Measurements 125 (4) -- A De-embedding Technique for Interconnects 129 (4) -- Characterization of Thin Film Organic Materials at High Frequency 133 (4) -- Complex Dielectric Constant Measurement Techniques for High-Speed Signaling 137 (4) -- Modeling Techniques -- Model Extraction and Waveform Correlation via a Generalized Frequency-and Time-Domain Optimizer 141 (4) -- Equivalent Circuit Representation and Dimension Reduction Technique for Efficient FDTD Modeling of Power/Ground Plane (Student Paper) 145 (4) -- Modelling Complex Via Hole Structures 149 (4) -- Comparison Between Chebyshev and Power Series Expansion Functions for Interpolating Data 153 (4) -- Field Analysis in Inhomogeneously-Filled Stripline Circuits 157 (4) -- Modeling of Multi-vias Coupling for High Speed Interconnects 161 (4) -- Fast Capacitance Extraction of Conductors Embedded in a Layered Medium (Student Paper) 165 (4) -- Modeling of Interconnects and Electromagnetic Field Distributions Using FDTD Method 169 (4) -- Reduced-Order Models based on Measured S-Parameters for Time-Frequency Analysis of Microwave Circuits using Genetic Algorithms 173 (4) -- An Iteration-Free Fast Multilevel Solver for Dense Method of Moment Systems 177 (4) -- Fast Electromagnetic Modeling for Electronic Packaging in Layered Media 181 (4) -- An Alternating Implicit Block Overlapped FDTD (AIBO-FDTD) Method and Its Estimation with Parallel Computation 185 (4) -- Crosstalk for Curvilinear Conductors by Utilising a Nonuniform Transmission Line Approach 189 (4) -- Unit Cell Modeling of Meander Delay Line based on Finite-Difference Time-Domain Method and Floquet's Theorem (Student Paper) 193 (6) -- TUESDAY, OCTOBER 30, 2001 -- SESSION VI - POWER DISTRIBUTION -- Simulations of Frequency Dependencies of Delta-I Noise 199 (4) -- Simultaneous Switching Noise Analysis on Bus Lines Using Coupled Circuit and Electromagnetic Simulation 203 (4) -- Analysis of Multi-Layered Irregular Power Distribution Planes with Vias Using Transmission Matrix Method (Student Paper) 207 (4) -- An Approach to Measuring Power Supply Impedance of Microprocessors 211 (4) -- Powering Intel® Pentium® 4 Generation Processors 215 (6) -- SESSION VII - EM MODELING -- Flat Package Industance Extraction with Ground Plane Current Precalculation (Student Paper) 221 (4) -- Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes 225 (4) -- Efficient Construction of Two-Port Passive Macromodels for Resonant Network (Student Paper) 229 (4) -- Coupled Electromagnetic-Circuit Simulation of Arbitraily-Shaped Conducting Structures 233 (4) -- New Efficient Method of Modeling Electronics Packages with Power and Ground Planes 237 (6) -- SESSION VIII - MODEL ORDER REDUCTION -- Recent Advances in Reduced-Order Modeling of Complex Interconnects 243 (4) -- Physically Consistent Transmission Line Models For High-Speed Interconnects in Lossy Dielectrics 247 (4) -- Triangle Impulse Response (TIR) Calculation for Lossy Transmission Line Simulation (Student Paper) 251 (4) -- A Comparative Study of Two Transient Analysis Algorithms for Lossy Transmission Lines with Frequency-Dependent Data 255 (4) -- Global Multi-Level Reduction Technique for Nonlinear Simulation of High-Speed Interconnect Circuits (Student Paper) 259 (6) -- SESSION IX - POWER DECOUPLING -- Modeling Shared-Via Decoupling in a Multi-Layered Structure using the CEMPIE Approach 265 (4) -- ARIES: Using Annual-Ring Embedded Resistors to Set Capacitor ESR in Power Distribution Networks 269 (4) -- Design Oriented Analysis of Package Power Distribution System Considering Target Impedance for High Performance Microprocessors 273 (4) -- Effective Decoupling Radius of Decoupling Capacitor 277 (6) -- WEDNESDAY, OCTOBER 31, 2001 -- SESSION X - SYSTEM DESIGN -- Modeling and Measurement of the Alpha 21364 Package 283 (4) -- SI and Design Considerations for Gbps PCBs In Communication Systems 287 (4) -- Design and Performance Evaluation of Pentium® III Microprocessor Packaging 291 (4) -- Design Optimization Methodology for Simultaneous Bidirectional Interface 295 (4) -- High Bandwidth Low Latency Chip To Chip Interconnects Using High Performance MLC Glass Ceramic Power4R MCM 299 (4) -- A Novel Efficient Approach of Including Frequency-Dependent Power Delivery Effects in Bus Signal Integrity Simulation 303 (6) -- SESSION XI - MEASUREMENT -- Package Model Extraction from Multi-port S-parameters 309 (4) -- Understanding Modeling and Measurements of Differential Transmission Lines 313 (4) -- Experimental Study of the Ground Plane in Asymmetric Coupled Silicon Lines 317 (4) -- High Sensitivity Magnetic Near Field Probe Based on Ferromagnetic Thin-Film Technology 321 (6) -- SESSION XII - MODELING -- Solution Space Analysis of 327 $a Interconnects for Low Voltage Differential Signaling (LVDS) Applications 327 (4) -- Behavioral Modeling of Digital IC Input and Output Ports 331 (4) -- Accurate Closed-Forum Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate 335 (4) -- RF Modeling of Vertical Interconnection Between Power-Ground Plane Combined with 2D TLM 339 (4) -- Author Index 343. 606 $aElectronic packaging$vCongresses 615 0$aElectronic packaging 676 $a621.381/046 712 02$aIEEE Microwave Theory and Techniques Society Staff 712 12$aTopical Meeting on Electrical Performance of Electronic Packaging$d(10th :$f2001 :$eCambridge, Mass.) 801 0$bPQKB 906 $aPROCEEDING 912 $a996213505003316 996 $a2001 IEEE Electrical Performance of Electronic Packaging$92511785 997 $aUNISA