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200 10$aPolytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics $eOdaiba, Tokyo, Japan, January 15-18, 2007 s /$fIEEE Components, Packaging and Manufacturing Technology Society
210   $cIEEE
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311   $a1-4244-1186-6 
517   $aPolytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
517   $aElectronics Communications and Computers 
531   $aPOLMYERS & ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ON
531   $aPOLMYERS AND ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ON
531   $aPOLYMERS & ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2007. POLYTRONIC 2007. 6TH INTERNATIONAL CONFERENCE ON
606   $aMicroelectronic packaging$xMaterials$vCongresses
606   $aPolymers$vCongresses
606   $aIntegrated circuits$xReliability$vCongresses
606   $aPhotonics$xMaterials$vCongresses
606   $aPolymeric composites$vCongresses
615  0$aMicroelectronic packaging$xMaterials
615  0$aPolymers
615  0$aIntegrated circuits$xReliability
615  0$aPhotonics$xMaterials
615  0$aPolymeric composites
712 02$aInstitute of Electrical and Electronics Engineers.
906   $aPROCEEDING
912   $a996281139003316
996   $aPolytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics$92871620
997   $aUNISA