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200 10$a2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) $e1-4 April 2014 : Cannes, France /$fIEEE
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2014.
215   $a1 online resource (376 pages)
300   $aIncludes index.
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311   $a2-35500-028-X 
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