LEADER 01167nam 2200337 450 001 996280711003316 005 20230814223113.0 010 $a4-9902188-5-X 035 $a(CKB)4100000005061491 035 $a(WaSeSS)IndRDA00122635 035 $a(EXLCZ)994100000005061491 100 $a20200506d2018 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aICEP-IAAC $e2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 /$fsponsored by Japan Institute of Electronics Packaging [and three others] 210 1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2018. 215 $a1 online resource (584 pages) 311 $a1-5386-4864-4 606 $aElectronic packaging$vCongresses 615 0$aElectronic packaging 676 $a621.381046 712 02$aErekutoronikusu Jisso? Gakkai, 801 0$bWaSeSS 801 1$bWaSeSS 906 $aPROCEEDING 912 $a996280711003316 996 $aICEP-IAAC$92526902 997 $aUNISA