LEADER 01621oam  2200337z- 450 
001 996279698403316
005 20080801083836.0
010   $a1-5090-9224-2
035   $a(CKB)1000000000331301
035   $a(EXLCZ)991000000000331301
100   $a20220608c2006uuuu  -u-            -
101 0 $aeng
200 10$a10th IEEE Workshop on Signal Propagation on Interconnects $eMay 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings /$fco-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
210   $cIEEE
311   $a1-4244-0454-1 
311   $a1-4244-0455-X 
517   $a2006 IEEE Workship on Signal Propagation on Interconnects
517   $aSystems, Man and Cybernetics 
606   $aPrinted circuits$vCongresses
606   $aInterconnects (Integrated circuit technology)$vCongresses
606   $aSignal theory (Telecommunication)$vCongresses
615  0$aPrinted circuits
615  0$aInterconnects (Integrated circuit technology)
615  0$aSignal theory (Telecommunication)
676   $a621.3815/31
712 02$aComponents, Packaging & Manufacturing Technology Society.$bTechnical Committee on Electrical Design, Modeling and Simulation.
712 02$aIEEE Computer Society.$bTechnical Council on Test Technology.
906   $aPROCEEDING
912   $a996279698403316
996   $a10th IEEE Workshop on Signal Propagation on Interconnects$92872422
997   $aUNISA