LEADER 01564nam  2200337   450 
001 996279667403316
005 20230420120034.0
035   $a(CKB)4100000000771574
035   $a(NjHacI)994100000000771574
035   $a(EXLCZ)994100000000771574
100   $a20230420d2017      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cIEEE,$d2017.
215   $a1 online resource
311   $a1-5386-1216-X 
330   $aAnnotation In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers It offers a public arena for the exchange of up to date experiences among manufacturers for adoption of technological developments.
517   $a2017 Joint International Symposium on e-Manufacturing and Design Collaboration 
606   $aEngineering design$vCongresses
615  0$aEngineering design
676   $a620.0042
801  0$bNjHacI
801  1$bNjHacl
906   $aPROCEEDING
912   $a996279667403316
996   $a2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM)$92501748
997   $aUNISA