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035   $a(CONSER)--2018200150
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181   $ctxt$2rdacontent
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200 10$aProceedings /$fAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
210  1$aNew York, NY :$cInstitute of Electrical and Electronics Engineers,$d1991-
311   $a1065-2221 
606   $aSemiconductors$xThermal properties$vCongresses
606   $aSemiconductors$xCooling$vCongresses
606   $aAmorphous semiconductors$xThermal properties$vCongresses
606   $aIntegrated circuits$vCongresses
606   $aAmorphous semiconductors$xThermal properties$2fast$3(OCoLC)fst00807853
606   $aIntegrated circuits$2fast$3(OCoLC)fst00975535
606   $aSemiconductors$xCooling$2fast$3(OCoLC)fst01112209
606   $aSemiconductors$xThermal properties$2fast$3(OCoLC)fst01112264
608   $aConference papers and proceedings.$2fast
615  0$aSemiconductors$xThermal properties
615  0$aSemiconductors$xCooling
615  0$aAmorphous semiconductors$xThermal properties
615  0$aIntegrated circuits
615  7$aAmorphous semiconductors$xThermal properties.
615  7$aIntegrated circuits.
615  7$aSemiconductors$xCooling.
615  7$aSemiconductors$xThermal properties.
676   $a621
676   $a621.3815/2
712 02$aIEEE Components, Hybrids, and Manufacturing Technology Society.
906   $aCONFERENCE
912   $a996279663203316
996   $aProceedings$957126
997   $aUNISA