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100   $a20160829d1997      uy              
101 0 $aeng
181   $ctxt
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200 10$aProceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado
210 31$a[Place of publication not identified]$cInstitute of Electrical and Electronics Engineers$d1997
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-3787-5 
606   $aMultichip modules (Microelectronics)$xCongresses
606   $aMicroelectronic packaging$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aMultichip modules (Microelectronics)$xCongresses
615  0$aMicroelectronic packaging$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
712 02$aInternational Society for Hybrid Microelectronics
712 12$aInternational Conference and Exhibition on Multichip Modules
801  0$bPQKB
906   $aBOOK
912   $a996217392003316
996   $aProceedings : 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado$92546376
997   $aUNISA