LEADER 02125nas  22004933a 450 
001 996216561203316
005 20240413020643.0
011   $a1558-3686
035   $a(OCoLC)44452804
035   $a(CKB)954926999219
035   $a(CONSER)  2005215261
035   $a(DE-599)ZDB1070-9894;1558-3686
035   $a(EXLCZ)99954926999219
100   $a20000621b19941998  sy         a
101 0 $aeng
135   $aurcn||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aIEEE transactions on components, packaging, and manufacturing technology$hPart B$iAdvanced packaging $ea publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society
210   $aNew York, NY $cInstitute of Electrical and Electronics Engineers$dc1994-c1998
300   $aTitle from IEEExplore homepage (viewed Jun. 21, 2000).
300   $aRefereed/Peer-reviewed
311   $a1070-9894 
606   $aElectronic packaging$vPeriodicals
606   $aElectronic industries$vPeriodicals
606   $aMise sous boi?tier (E?lectronique)$2rasuqam
606   $aMise sous boi?tier (E?lectronique)$xPe?riodiques
606   $aMise sous boi?tier (Microe?lectronique)$xPe?riodiques
608   $aPe?riodique e?lectronique (Descripteur de forme)$2rasuqam
608   $aRessource Internet (Descripteur de forme)$2rasuqam
615  0$aElectronic packaging
615  0$aElectronic industries
615  7$aMise sous boi?tier (E?lectronique)
615  6$aMise sous boi?tier (E?lectronique)$xPe?riodiques.
615  6$aMise sous boi?tier (Microe?lectronique)$xPe?riodiques.
676   $a621.3
712 02$aInstitute of Electrical and Electronics Engineers.
712 02$aLasers and Electro-optics Society (Institute of Electrical and Electronics Engineers)
712 02$aComponents, Packaging & Manufacturing Technology Society.
906   $aJOURNAL
912   $a996216561203316
996   $aIEEE transactions on components, packaging, and manufacturing technology$92461542
997   $aUNISA