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010   $a1-4244-0665-X
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035   $a(SSID)ssj0000394661
035   $a(PQKBManifestationID)12144083
035   $a(PQKBTitleCode)TC0000394661
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100   $a20160829d2006      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore
210 31$a[Place of publication not identified]$cIEEE$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-0664-1 
606   $aElectronic packaging$vCongresses
606   $aMicroelectronics$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  0$aMicroelectronics
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aIEEE Reliability/CPMT/ED Singapore Chapter
712 02$aInternational Microelectronics and Packaging Society
712 12$aElectronic Packaging Technology Conference
801  0$bPQKB
906   $aPROCEEDING
912   $a996215697003316
996   $a2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore$92524035
997   $aUNISA