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200 10$a2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
210 31$a[Place of publication not identified]$cIEEE$d2012
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300   $aBibliographic Level Mode of Issuance: Monograph
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606   $aPhotonics$xMaterials$vCongresses
606   $aThree-dimensional integrated circuits
606   $aSealing (Technology)$vCongresses
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