LEADER 02192oam  2200553zu 450 
001 996212593703316
005 20210807003355.0
035   $a(CKB)111026746722772
035   $a(SSID)ssj0000395085
035   $a(PQKBManifestationID)12154915
035   $a(PQKBTitleCode)TC0000395085
035   $a(PQKBWorkID)10449853
035   $a(PQKB)10646649
035   $a(EXLCZ)99111026746722772
100   $a20160829d1998      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1998 Fourth International High Temperature Electronics Conference : HITEC, Albuquerque, New Mexico, USA, June 14-18, 1998
210 31$a[Place of publication not identified]$cThe Institute of Electrical and Electronics Engineers Inc$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4540-1 
606   $aElectronics$xMaterials$xCongresses
606   $aHeat resistant materials$vCongresses
606   $aSilicon-on-insulator technology$xCongresses
606   $aField-effect transistors$xCongresses
606   $aGallium arsenide$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aElectronics$xMaterials$xCongresses
615  0$aHeat resistant materials
615  0$aSilicon-on-insulator technology$xCongresses
615  0$aField-effect transistors$xCongresses
615  0$aGallium arsenide$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/04
712 02$aAir Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)
712 02$aIEEE Electron Devices Society
712 02$aComponents, Packaging & Manufacturing Technology Society
712 12$aInternational High Temperature Electronics Conference
801  0$bPQKB
906   $aPROCEEDING
912   $a996212593703316
996   $a1998 Fourth International High Temperature Electronics Conference : HITEC, Albuquerque, New Mexico, USA, June 14-18, 1998$92507918
997   $aUNISA