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100   $a20160829d1998      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1998 International Conference on Multichip Modules and High Density Packaging
210 31$a[Place of publication not identified]$cIEEE$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4850-8 
606   $aMultichip modules (Microelectronics)$xCongresses
606   $aMicroelectronic packaging$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aMultichip modules (Microelectronics)$xCongresses
615  0$aMicroelectronic packaging$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/046
712 02$aInternational Microelectronics and Packaging Society
712 02$aIEEE, Institute of Electrical and Electronics Engineers, Inc. Staff
712 12$aInternational Conference on Multichip Modules and High Density Packaging
801  0$bPQKB
906   $aPROCEEDING
912   $a996212591603316
996   $a1998 International Conference on Multichip Modules and High Density Packaging$92504364
997   $aUNISA