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100   $a20160829d1997      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aProceedings of the 1997 1st Electronic Packaging Technology Conference
210 31$a[Place of publication not identified]$cInstitute of Electrical and Electronics Engineers$d1997
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-4157-0 
606   $aElectronic packaging$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aElectronic packaging$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/046
702   $aTay$b Andrew A. O
712 02$aComponents, Packaging & Manufacturing Technology Society Singapore Chapter.
712 12$aElectronic Packaging Technology Conference
801  0$bPQKB
906   $aBOOK
912   $a996212477703316
996   $aProceedings of the 1997 1st Electronic Packaging Technology Conference$92545677
997   $aUNISA