LEADER 01662oam  2200433zu 450 
001 996207641003316
005 20210806235949.0
010   $a1-5090-9297-8
035   $a(CKB)1000000000278357
035   $a(SSID)ssj0000393598
035   $a(PQKBManifestationID)12151858
035   $a(PQKBTitleCode)TC0000393598
035   $a(PQKBWorkID)10380133
035   $a(PQKB)10538581
035   $a(EXLCZ)991000000000278357
100   $a20160829d2006      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aIEEE International Symposium and Exhibition on Advanced Packaging Materials : processes, properties and interfaces : March 15-17, 2006, Atlanta, GA
210 31$a[Place of publication not identified]$cInstitute of Electrical and Electronics Engineers$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-0260-3 
606   $aElectronic packaging$xMaterials$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging$xMaterials
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 12$aInternational Symposium on Advanced Packaging Materials
801  0$bPQKB
906   $aPROCEEDING
912   $a996207641003316
996   $aIEEE International Symposium and Exhibition on Advanced Packaging Materials : processes, properties and interfaces : March 15-17, 2006, Atlanta, GA$92504874
997   $aUNISA