LEADER 01225nam  2200361   450 
001 996207512903316
005 20180326133337.0
010   $a1-5090-9087-8
035   $a(CKB)1000000000278217
035   $a(WaSeSS)IndRDA00096507
035   $a(EXLCZ)991000000000278217
100   $a20180326d2006      ||             |
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aITHERM 2006 $eThermal and Thermomechanical proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 : May 30, 2006-June 2, 2006
210  1$aNew York :$cIEEE,$d2006.
215   $a1 online resource (200 pages)
311   $a0-7803-9524-7 
606   $aElectronic apparatus and appliances$xThermal properties$vCongresses
606   $aHeat sinks (Electronics)$vCongresses
606   $aBall grid array technology$vCongresses
615  0$aElectronic apparatus and appliances$xThermal properties
615  0$aHeat sinks (Electronics)
615  0$aBall grid array technology
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a996207512903316
996   $aITHERM 2006$92523245
997   $aUNISA