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183   $acr
200 10$aPolytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wroc?aw, Poland : proceedings
210 31$a[Place of publication not identified]$cIEEE$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-9553-0 
606   $aMicroelectronic packaging$xMaterials$vCongresses
606   $aPolymers$xReliability$vCongresses
606   $aIntegrated circuits$xMaterials$vCongresses
606   $aPhotonics$vCongresses
606   $aPolymeric composites$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aMicroelectronic packaging$xMaterials
615  0$aPolymers$xReliability
615  0$aIntegrated circuits$xMaterials
615  0$aPhotonics
615  0$aPolymeric composites
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381046
712 02$aInstitute of Electrical and Electronics Engineers
712 12$aInternational IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
801  0$bPQKB
906   $aPROCEEDING
912   $a996207502403316
996   $aPolytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wroc?aw, Poland : proceedings$92522575
997   $aUNISA