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001 996207134503316
005 20240413021440.0
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035   $a(CONSER)---93640588-
035   $a(EXLCZ)99958480258724
100   $a19920827a19929999  ---         a
101 0 $aeng
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aAdvanced packaging $ean IHS Group publication
210   $aLibertyville, Ill., USA $cIHS Pub. Group$dc1992-
215   $a1 online resource
300   $aTitle from cover.
300   $aPublisher varies.
311 08$aPrint version: Advanced packaging : 1065-0555 (DLC)   93640588 (OCoLC)26493484 
531   $aADV PACKAG
531 0 $aAdv. packag.
606   $aHybrid integrated circuits$xDesign and construction$vPeriodicals
606   $aMicroelectronic packaging$vPeriodicals
606   $aHybrid integrated circuits$xDesign and construction$2fast$3(OCoLC)fst00964518
606   $aMicroelectronic packaging$2fast$3(OCoLC)fst01019751
608   $aPeriodicals.$2fast
615  0$aHybrid integrated circuits$xDesign and construction
615  0$aMicroelectronic packaging
615  7$aHybrid integrated circuits$xDesign and construction.
615  7$aMicroelectronic packaging.
676   $a621.381/046/05
906   $aJOURNAL
912   $a996207134503316
920   $aexl_impl conversion
996   $aAdvanced packaging$92328229
997   $aUNISA