LEADER 01418oam  2200457zu 450 
001 996206290303316
005 20210807003059.0
010   $a1-5090-7810-X
010   $a1-4244-1912-3
035   $a(CKB)1000000000710929
035   $a(SSID)ssj0000453263
035   $a(PQKBManifestationID)12168545
035   $a(PQKBTitleCode)TC0000453263
035   $a(PQKBWorkID)10481227
035   $a(PQKB)10195092
035   $a(NjHacI)991000000000710929
035   $a(EXLCZ)991000000000710929
100   $a20160829d2008      uy              
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2008 IEEE International Interconnect Technology Conference
210 31$a[Place of publication not identified]$cI E E E$d2008
215   $a1 online resource
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-1911-5 
606   $aSemiconductors$xDesign and construction$vCongresses
606   $aSemiconductors$xJunctions
606   $aElectric contacts$vCongresses
615  0$aSemiconductors$xDesign and construction
615  0$aSemiconductors$xJunctions.
615  0$aElectric contacts
676   $a621.317
702   $aIEEE Staff
801  0$bPQKB
906   $aPROCEEDING
912   $a996206290303316
996   $a2008 IEEE International Interconnect Technology Conference$92534721
997   $aUNISA