LEADER 00718nam0-22002651i-450- 001 990004904460403321 005 19990530 035 $a000490446 035 $aFED01000490446 035 $a(Aleph)000490446FED01 035 $a000490446 100 $a19990530g19639999km-y0itay50------ba 101 0 $aita 105 $ay-------001yy 200 1 $aEnglish Prose Style$fHerbert Read 210 $aLondon$cG. Bell and Sons$d1963. 215 $aXIV, 216 p.$d22 cm 700 1$aRead,$bHerbert$f<1893-1968>$023576 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990004904460403321 952 $aR 58 REA$bFil. Mod. 12529$fFLFBC 959 $aFLFBC 996 $aEnglish Prose Style$9524735 997 $aUNINA LEADER 02021oam 2200529zu 450 001 996204495903316 005 20210806235952.0 035 $a(CKB)1000000000022462 035 $a(SSID)ssj0000395916 035 $a(PQKBManifestationID)12121613 035 $a(PQKBTitleCode)TC0000395916 035 $a(PQKBWorkID)10459119 035 $a(PQKB)11527960 035 $a(EXLCZ)991000000000022462 100 $a20160829d2004 uy 101 0 $aeng 181 $ctxt 182 $cc 183 $acr 200 10$a2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR 210 31$a[Place of publication not identified]$cIEEE$d2004 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-7803-8744-9 606 $aMicroelectronic packaging$xMaterials$vCongresses 606 $aPolymers$xReliability$vCongresses 606 $aIntegrated circuits$xMaterials$vCongresses 606 $aPhotonics$vCongresses 606 $aPolymeric composites$vCongresses 606 $aElectrical & Computer Engineering$2HILCC 606 $aEngineering & Applied Sciences$2HILCC 606 $aElectrical Engineering$2HILCC 615 0$aMicroelectronic packaging$xMaterials 615 0$aPolymers$xReliability 615 0$aIntegrated circuits$xMaterials 615 0$aPhotonics 615 0$aPolymeric composites 615 7$aElectrical & Computer Engineering 615 7$aEngineering & Applied Sciences 615 7$aElectrical Engineering 676 $a621.381/046 712 02$aInstitute of Electrical and Electronics Engineers 712 12$aInternational IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics 801 0$bPQKB 906 $aPROCEEDING 912 $a996204495903316 996 $a2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR$92540907 997 $aUNISA LEADER 04209nam 22007215 450 001 9910983037503321 005 20250216115535.0 010 $a9789819786312 010 $a9819786312 024 7 $a10.1007/978-981-97-8631-2 035 $a(MiAaPQ)EBC31909400 035 $a(Au-PeEL)EBL31909400 035 $a(CKB)37614942600041 035 $a(DE-He213)978-981-97-8631-2 035 $a(OCoLC)1500643139 035 $a(EXLCZ)9937614942600041 100 $a20250216d2025 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aIntelligent Computing and Networking $eProceedings of IC-ICN 2024 /$fedited by George Ghinea, Vijay Bhaskar Semwal, Anand Khandare 205 $a1st ed. 2025. 210 1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2025. 215 $a1 online resource (326 pages) 225 1 $aLecture Notes in Networks and Systems,$x2367-3389 ;$v1172 311 08$a9789819786305 311 08$a9819786304 327 $aChapter 1: Identification of potholes and speed bumps using SSD & YOLO -- Chapter 2: Webcam-Based Real-Time Indian Sign Language Recognition for Inclusive Communication -- Chapter 3: Performance Analysis of Medical Image Fusion Using Wavelet Technique -- Chapter 4: Correlation Analysis and Stock Market Prediction of Nifty and Nasdaq Indices Using Machine Learning Techniques -- Chapter 5: Integrated RFID-Verified Smart Manufacturing System for Bottle production using industry 4.0 -- Chapter 6: Comparing Advanced Programming Languages Based on Machine Learning (ML) -- Chapter 7: Optimal Cluster and Node Balancing Technique using K-Mean based on Q-Learning for Wireless Sensor Network -- Chapter 8: Optimizing Iot Task Offloading With Federated Deep Reinforcement Learning In Vehicle And Industrial Environments -- Chapter 9: Enhancing Video Action Recognition with Spatial-Temporal Convolutional Attention Networks -- Chapter 10: Spatial Federated Learning Based Blockchain Mechanism for Smart Contract Vulnerability Detection. etc. 330 $aThis book gathers high-quality peer-reviewed research papers presented at the International Conference on Intelligent Computing and Networking (IC-ICN 2024), organized by the Computer Department, Thakur College of Engineering and Technology, in Mumbai, Maharashtra, India, on February 23?24, 2024. The book includes innovative and novel papers in the areas of intelligent computing, artificial intelligence, machine learning, deep learning, fuzzy logic, natural language processing, human?machine interaction, big data mining, data science and mining, applications of intelligent systems in healthcare, finance, agriculture and manufacturing, high-performance computing, computer networking, sensor and wireless networks, Internet of Things (IoT), software-defined networks, cryptography, mobile computing, digital forensics, and blockchain technology. 410 0$aLecture Notes in Networks and Systems,$x2367-3389 ;$v1172 606 $aTelecommunication 606 $aComputational intelligence 606 $aArtificial intelligence 606 $aQuantitative research 606 $aCloud computing 606 $aCommunications Engineering, Networks 606 $aComputational Intelligence 606 $aArtificial Intelligence 606 $aData Analysis and Big Data 606 $aCloud Computing 615 0$aTelecommunication. 615 0$aComputational intelligence. 615 0$aArtificial intelligence. 615 0$aQuantitative research. 615 0$aCloud computing. 615 14$aCommunications Engineering, Networks. 615 24$aComputational Intelligence. 615 24$aArtificial Intelligence. 615 24$aData Analysis and Big Data. 615 24$aCloud Computing. 676 $a621.382 700 $aGhinea$b George$01765867 701 $aSemwal$b Vijay Bhaskar$01429565 701 $aKhandare$b Anand$01784984 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910983037503321 996 $aIntelligent Computing and Networking$94316619 997 $aUNINA