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200 10$a2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR
210 31$a[Place of publication not identified]$cIEEE$d2004
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-8744-9 
606   $aMicroelectronic packaging$xMaterials$vCongresses
606   $aPolymers$xReliability$vCongresses
606   $aIntegrated circuits$xMaterials$vCongresses
606   $aPhotonics$vCongresses
606   $aPolymeric composites$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aMicroelectronic packaging$xMaterials
615  0$aPolymers$xReliability
615  0$aIntegrated circuits$xMaterials
615  0$aPhotonics
615  0$aPolymeric composites
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/046
712 02$aInstitute of Electrical and Electronics Engineers
712 12$aInternational IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
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912   $a996204495903316
996   $a2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR$92540907
997   $aUNISA