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100   $a20160829d2004      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aElectronics packaging technology conference : proceedings of 6th Electronics Packaging Technology Conference : (EPTC 2004) : 8-10 December, 2004, Pan Pacific Hotel, Singapore
210 31$a[Place of publication not identified]$cIEEE$d2004
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-8821-6 
606   $aElectronic packaging$vCongresses
606   $aMicroelectronics$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  0$aMicroelectronics
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
702   $aToh$b Kok Chuan
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aIEEE Reliability/CPMT/ED Singapore Chapter
712 02$aInternational Microelectronics and Packaging Society
712 12$aElectronic Packaging Technology Conference
801  0$bPQKB
906   $aPROCEEDING
912   $a996204487303316
996   $aElectronics packaging technology conference : proceedings of 6th Electronics Packaging Technology Conference : (EPTC 2004) : 8-10 December, 2004, Pan Pacific Hotel, Singapore$92505583
997   $aUNISA